Joining device and joining method

Abstract

This invention provides a bonding apparatus and a bonding method to improve the bonding quality of a die to a target substrate. The bonding apparatus of this invention bonds a die to a target substrate. The bonding apparatus includes: a substrate stage for holding the target substrate; a first adsorption head for adsorbing the die; a first moving mechanism for moving the die along with the first adsorption head to press the die against the target substrate; a spray head for spraying a third gas along the holding surface of the target substrate in the substrate stage or the bonding surface of the target substrate held by the substrate stage; and a base on which the substrate stage and the spray head are mounted.

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