Package structure and manufacturing method thereof

TW202637004APending Publication Date: 2026-09-01SONIX TECH
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Patent Information

Application Number
TW114105805
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-02-17
Publication Date
2026-09-01

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    Figure TWG2TA001073669_003
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Abstract

A package structure and a manufacturing method thereof are provided. The package structure includes a metal core substrate, a sensor and a cover. The sensor is disposed on the metal core substrate. The cover is disposed on the metal core substrate. The cover is sealed with the metal core substrate to form a vacuum cavity. The sensor is located within the vacuum cavity. The cover includes a filter portion. An orthographic projection of the filter portion on the metal core substrate is overlapped with an orthographic projection of the sensor on the metal core substrate.
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