Heat dissipation package and method for manufacturing the same

Abstract

A method for manufacturing a heat dissipation package is disclosed. Heat dissipation layers each including a main portion and a carry portion are provided, the carry portion is located on an inner surface of the main portion and has a carry surface. A thermally conductive uncured material is provided on and confined on the carry surface. Electronic devices are bonded to the thermally conductive uncured material to be connected with the heat dissipation layers. Owing to the thermally conductive uncured material is confined on the carry surface, displacement of the electronic devices caused by cohesion property of the thermally conductive uncured material will not be observed.

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