Methods and equipment for simultaneously transferring large quantities of micro conductive pillars

Abstract

A method for simultaneously transferring a plurality of micro-conductive pillars includes providing a substrate. A plurality of micro holes are opened on the substrate. A carrier is provided, and a glue layer is provided on a surface of the carrier. The micro-conductive pillars are arranged on the adhesive layer, and the carrier is placed above the substrate. The micro-conductive pillars face the substrate. Through laser beam excitation, the carrier is projected to remove the glue layer located under each micro-conductive pillar, so that each micro conductive pillar falls into each micro hole. Conductive glue is coated on a first surface of the substrate and the conductive glue fills a gap between the micro conductive pillars and the corresponding micro holes. Grind the surfaces of the substrate so that both ends of the micro conductive pillar are flush with the first surface and the second surface respectively.

Description

Technical Field

[0001] This invention relates to a method and apparatus for placing micro-conductive pillars into micro-holes, and more particularly to a method and apparatus for placing micro-conductive pillars into micro-holes in semiconductor packaging processes. Prior Technology

[0002] With the development of semiconductor technology, chip packaging technology has become increasingly complex, often involving processes that place or fill multiple conductive materials into or within vias in a substrate. As products become increasingly sophisticated, the quantity and efficiency of placing or filling multiple conductive materials into or within vias in existing technologies are limited.

[0003] Therefore, how to improve the structure and process to increase the amount of conductive material placed or filled in the micropores and improve the process efficiency in order to overcome the above-mentioned defects has become one of the important issues that this industry wants to solve. Summary of the Invention

[0004] This invention provides a method for simultaneously transferring a large number of micro-conductive pillars, comprising: providing a substrate having opposing first and second surfaces; forming a plurality of micro-holes on the substrate, wherein the first aperture of each micro-hole on the first surface is larger than the second aperture of each micro-hole on the second surface; providing a carrier plate having an adhesive layer disposed on its surface; disposing the plurality of micro-conductive pillars on the adhesive layer, wherein the position of each micro-conductive pillar corresponds to the position of each micro-hole, and the cross-sectional area of ​​one end of each micro-conductive pillar is less than or equal to the first aperture and greater than the second aperture; placing the carrier plate above the substrate, with the plurality of micro-conductive pillars facing the first surface of the substrate, and the position of each micro-conductive pillar aligning with the position of its corresponding micro-hole; projecting the carrier plate using a laser beam to remove the adhesive layer located below each micro-conductive pillar, causing each micro-conductive pillar to fall into each micro-hole; and applying conductive adhesive to the first surface to fill the gap between each micro-conductive pillar and its corresponding micro-hole.

[0005] The present invention also provides a method for simultaneously transferring a large number of micro-conductive pillars, comprising: providing a substrate having opposing first and second surfaces; forming a plurality of micro-holes in the substrate; providing a carrier plate having an adhesive layer disposed on its surface; disposing a plurality of micro-conductive pillars on the adhesive layer, each micro-conductive pillar being positioned corresponding to the position of each micro-hole, each micro-conductive pillar comprising a body and a substrate, a plurality of substrates being located on the adhesive layer, the width diameter of each substrate being larger than the aperture of each micro-hole; placing the carrier plate above the substrate, the plurality of bodies facing the first surface of the substrate, each micro-conductive pillar being aligned with its corresponding micro-hole; projecting the carrier plate by laser beam excitation to remove the adhesive layer located under each substrate, causing each micro-conductive pillar to fall into each micro-hole, each substrate protruding from each micro-hole; and applying a conductive adhesive to the second surface to fill the gap between each body and its corresponding micro-hole.

[0006] According to a feasible implementation scheme, the method for transferring a large number of micro-conductive pillars also includes performing a grinding step to grind and flatten at least one of the first surface and the second surface.

[0007] According to a feasible implementation scheme, the method for transferring a large number of micro-conductive pillars also includes, after performing a grinding step, setting a heat dissipation layer on a first surface or a second surface of the substrate.

[0008] The present invention also provides a device for simultaneously transferring a large number of micro conductive pillars, comprising: a management module, an opening module, an installation module, a positioning module, a laser module, and a coating module.

[0009] The module includes several electrical connection management components: an aperture module for creating multiple micro-holes on a substrate, wherein the diameter of each micro-hole on a first surface is larger than the diameter of each micro-hole on a second surface; a mounting module for placing multiple micro-conductive pillars on an adhesive layer laid on a carrier plate, with each micro-conductive pillar positioned corresponding to a micro-hole, and the cross-sectional area of ​​one end of each micro-conductive pillar being less than or equal to the first diameter and greater than the second diameter; a positioning module for placing the carrier plate above the substrate, with the multiple micro-conductive pillars facing the first surface of the substrate, and each micro-conductive pillar aligned with the corresponding micro-hole; and a laser module for electrical connection management, which uses a laser beam to excite and project the carrier plate to remove the adhesive layer beneath each micro-conductive pillar, causing each micro-conductive pillar to fall into each micro-hole. The coating module is an electrical connection management module. The coating module is used to coat conductive adhesive on the first surface so that the conductive adhesive fills the gap between each micro conductive post and the corresponding micropore.

[0010] The present invention further provides a device for simultaneously transferring a large number of micro conductive pillars, which includes: a management module, an opening module, an installation module, a positioning module, a laser module, and a coating module.

[0011] The module comprises several electrical connection management components: an aperture module (for creating multiple micro-holes on a substrate), a mounting module (for placing multiple micro-conductive pillars on an adhesive layer laid on a carrier plate), and a positioning module (for placing the carrier plate above the substrate with the micro-conductive pillars facing the first surface of the substrate, each micro-conductive pillar being aligned with the corresponding micro-hole). Finally, a laser module, which uses a laser beam to excite and project the carrier plate to remove the adhesive layer beneath each substrate, causing each micro-conductive pillar to fall into each micro-hole, with each substrate protruding from each micro-hole. The coating module is an electrical connection management module. The coating module is used to coat conductive adhesive on the second surface so that the conductive adhesive fills the gap between each body and the corresponding micropore.

[0012] According to a feasible implementation scheme, the device for transferring a large number of micro conductive pillars also includes a grinding module, an electrical connection management module, and the grinding module grinds and flattens at least one of the first surface and the second surface.

[0013] According to a feasible implementation, the device for simultaneously transferring a large number of micro-conductive pillars also includes a spraying module for spraying a heat dissipation layer onto a first or second surface of a substrate.

[0014] In one embodiment of the method for simultaneously transferring a large number of micro conductive pillars according to the present invention, a large number of micro conductive pillars can be transferred, thereby improving the efficiency of the packaging process.

[0015] In one embodiment of the method for simultaneously transferring a large number of micro conductive pillars according to the present invention, a heat dissipation layer may be provided to improve the heat dissipation effect of the packaging structure.

[0016] In one embodiment of the device for simultaneously transferring a large number of micro conductive pillars according to the present invention, the device can perform a large-scale transfer of micro conductive pillars through the operation of modules such as management module, opening module, mounting module, positioning module, laser module and coating module, thereby improving the efficiency of the packaging process.

[0017] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are for reference and illustration only and are not intended to limit the present invention. Simple Explanation of the Diagram

[0018] Figure 1 is a schematic flowchart of a method for simultaneously transferring a large number of micro-conductive pillars according to an embodiment of the present invention.

[0019] Figures 2 to 9 are schematic diagrams of each step in the embodiment shown in Figure 1.

[0020] Figure 10 is a schematic flowchart of a method for simultaneously transferring a large number of micro-conductive pillars according to an embodiment of the present invention.

[0021] Figures 11 to 18 are schematic diagrams of each step in the embodiment shown in Figure 10.

[0022] Figure 19 is a schematic diagram of the architecture of a device for simultaneously transferring a large number of micro conductive pillars according to an embodiment of the present invention. Implementation

[0023] The following specific embodiments illustrate the implementation of the "method and apparatus for simultaneously transferring a large number of micro-conductive pillars" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions of actual dimensions; this is stated in advance. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention.

[0024] Please refer to Figures 1 to 9. Figure 1 is a flowchart illustrating a method 100 for simultaneously transferring a large number of micro-conductive pillars according to an embodiment of the present invention. Figures 2 to 9 are schematic diagrams corresponding to each step in the embodiment shown in Figure 1. The method 100 includes steps S1 to S9.

[0025] As shown in Figure 2, steps S1 and S2 are performed. Step S1: A substrate 1 is provided, having a first surface 11 and a second surface 12 facing each other. In some embodiments, the substrate 1 is glass, or it may be a diamond substrate. In other embodiments, the substrate 1 is a ceramic substrate. In still other embodiments, the substrate 1 is a silicon substrate. Step S2: A plurality of micro-holes 13 are formed on the substrate 1. The micro-holes 13 may be blind vias or through-holes (the following embodiments use through-holes as an example). For example, the micro-holes 13 are formed on the substrate 1 by dry etching or wet etching. According to some embodiments, the micro-holes 13 may also be formed by laser means. The first aperture 131 of each micro-hole 13 on the first surface 11 is larger than the second aperture 132 of each micro-hole 13 on the second surface 12. According to some embodiments, the space (shape of the micro-hole 13) within each of the plurality of micro-holes 13 may be the same, or all may be different, or some may be the same and others different. In the embodiment shown in Figure 2, the space within each micropore 13 is identical.

[0026] As shown in Figure 3, steps S3 and S4 are executed. Step S3: A carrier plate 6 is provided, and an adhesive layer 3 is disposed on the surface of the carrier plate 6. Step S4: Multiple micro-conductive pillars 2 are disposed on the adhesive layer 3. The position of each micro-conductive pillar 2 corresponds to the position of each micro-hole 2. The cross-sectional area of ​​one end of each micro-conductive pillar 2 is less than or equal to the first aperture 131 and greater than the second aperture 132.

[0027] The carrier plate 6 is, for example, glass. The arrangement (position) of the plurality of micro-conductive pillars 2 corresponds to the plurality of micro-holes 13. That is, the arrangement pattern of the plurality of micro-conductive pillars 2 is consistent with the pattern of the plurality of micro-holes 13. According to some embodiments, the micro-conductive pillars 2 are copper pillars.

[0028] As shown in Figure 4, step S5 is performed: the carrier plate 6 is placed above the substrate 1, and multiple micro conductive pillars 2 face the first surface 11 of the substrate 1, with the position of each micro conductive pillar 2 aligned with the position of the corresponding micro hole 13.

[0029] As shown in Figures 5 and 6, step S6 is performed: the carrier plate 6 is projected by laser beam to remove the adhesive layer 3 located on the lower part of each micro conductive post 2 (see Figure 5), so that each micro conductive post 2 falls into each micro hole 13 (see Figure 6).

[0030] As shown in Figure 7, step S7 is performed: conductive adhesive 4 is applied to the first surface 11, filling the gap between each micro-conductive post 2 and the corresponding micro-hole 13. According to some embodiments, the conductive adhesive 4 is silver paste. According to some embodiments, the conductive adhesive 4 can be applied in a back-and-forth manner over a large area. According to other embodiments, the conductive adhesive 4 can be applied by spin coating.

[0031] In the embodiment shown in Figure 1, the method 100 for simultaneously transferring a large number of micro-conductive pillars also includes step S8. As shown in Figure 8, step S8 is performed by performing a grinding step, grinding and flattening at least one of the first surface 11 and the second surface 12. In this embodiment, after grinding and flattening, both ends of each micro-conductive pillar 2 are flush with the first surface 11 and the second surface 12, respectively.

[0032] In the embodiment shown in FIG1, the method 100 for simultaneously transferring a large number of micro-conductive pillars further includes, after performing step S8, performing step S9: setting a heat dissipation layer 5 on the first surface 11 or the second surface 12 of the substrate 1. In this embodiment, the heat dissipation layer 5 is set on the second surface 12, as shown in FIG9. The heat dissipation layer 5 covers a plurality of micro-conductive pillars 2. According to some packaging processes, the packaging structure has heat dissipation requirements; therefore, this method 100 further includes adding a heat dissipation layer 5 on the first surface 11 of the substrate 1. In some embodiments, the heat dissipation layer 5 is a thermally conductive adhesive, which may contain components such as silicone resin, polyurethane, and acrylate polymer. In some embodiments, the heat dissipation layer 5 is a graphene layer. According to some embodiments, the heat dissipation layer 5 is formed on the first surface 11 of the substrate 1 by spray coating. According to other embodiments, the heat dissipation layer 5 is deposited on the first surface 11 of the substrate 1 by sputtering.

[0033] Please refer to Figures 10 to 18. Figure 10 is a flowchart illustrating a method 200 for simultaneously transferring a large number of micro-conductive pillars according to another embodiment of the present invention. Figures 11 to 18 are schematic diagrams corresponding to each step in the embodiment shown in Figure 10. The method 200 includes steps P1 to P9.

[0034] As shown in Figure 11, steps P1 and P2 are performed. Step P1: A substrate 1 is provided, having a first surface 11 and a second surface 12 facing each other. Step P2: A plurality of micro-holes 13 are formed on the substrate 1. There are many ways to form the micro-holes 13, such as by dry etching or wet etching, or by laser processing. According to some embodiments, the space (shape of the micro-hole 13) within each of the plurality of micro-holes 13 may be the same, or all may be different, or some may be the same and others different. In the embodiment shown in Figure 10, the space within each micro-hole 13 is different.

[0035] As shown in Figure 12, steps P3 and P4 are executed. Step P3: A carrier plate 6 is provided, and an adhesive layer 3 is disposed on the surface of the carrier plate. Step P4: Multiple micro-conductive pillars 2 are disposed on the adhesive layer 3. The position of each micro-conductive pillar 2 corresponds to the position of each micro-hole 13. Each micro-conductive pillar 2 includes a body 21 and a substrate 22. Multiple substrates 22 are located on the adhesive layer 3, and the width of each substrate 22 is larger than the aperture 133 of each micro-hole. The arrangement (position) of the multiple micro-conductive pillars 2 corresponds to the multiple micro-holes 13. That is, the arrangement pattern of the multiple micro-conductive pillars 2 is consistent with the pattern of the multiple micro-holes 13. According to some embodiments, the micro-conductive pillars 2 are copper pillars.

[0036] As shown in Figure 13, step P5 is performed: the carrier plate 6 is placed above the substrate 1, and multiple bodies 21 face the first surface 11 of the substrate 1, with each micro conductive post 2 aligned with the corresponding micro hole 13.

[0037] As shown in Figures 14 and 15, step P6 is performed: the carrier plate 6 is excited by a laser beam to remove the adhesive layer 3 located in the lower part of each substrate 22 (see Figure 13), so that each micro conductive pillar falls into each micro hole 13, and each substrate 22 protrudes from each micro hole 13 (see Figure 14).

[0038] As shown in Figure 16, step P7 is performed: conductive adhesive 4 is applied to the second surface 12, so that the conductive adhesive 4 fills the gap between each body 21 and the corresponding micropore 13.

[0039] In the embodiment shown in FIG10, the method 100 for simultaneously transferring a large number of micro-conductive pillars further includes step P8. As shown in FIG17, grinding step P8 is performed: grinding flattening at least one of the first surface 11 and the second surface 12. In this embodiment, each substrate 22 and the conductive adhesive 4 are removed, so that the two ends of each body 21 are flush with the first surface 11 and the second surface 12, respectively.

[0040] In the embodiment shown in FIG10, the method 100 for simultaneously transferring a large number of micro-conductive pillars further includes, after performing step P8, performing step P9: disposing a heat dissipation layer 5 on a first surface 11 or a second surface 12 of the substrate 1. In this embodiment, the heat dissipation layer 5 is disposed on the second surface 12. The heat dissipation layer 5 covers a plurality of micro-conductive pillars 2 (see FIG18).

[0041] Please refer to Figure 19 and then refer to Figures 2 through 8 again. Figure 19 is a schematic diagram of the architecture of a device 7 for simultaneously transferring a large number of micro conductive pillars according to an embodiment of the present invention. The device 7 for simultaneously transferring a large number of micro conductive pillars includes: a management module 71, an opening module 72, a mounting module 73, a positioning module 74, a laser module 75, and a coating module 76.

[0042] The management module 71 is, for example, a computer. The aperture module 72 is electrically connected to the management module 71. The aperture module 72 is used to create a plurality of micro-holes 13 on the substrate 1. The first aperture 131 of each micro-hole 13 located on the first surface 11 is larger than the second aperture 132 of each micro-hole 13 located on the second surface 12. In some embodiments, the aperture module 72 is a laser module, which creates the micro-holes 13 on the substrate 1 by laser cutting.

[0043] The mounting module 73 is electrically connected to the management module 71. The mounting module 73 is used to place multiple micro conductive pillars 2 on the adhesive layer 3, which is laid on the carrier plate 6. The position of each micro conductive pillar 2 corresponds to the position of each micro hole 13. The cross-sectional area of ​​one end of each micro conductive pillar 2 is less than or equal to the first aperture 131 and greater than the second aperture 132.

[0044] The positioning module 74 is electrically connected to the management module 71. The positioning module 74 is used to place the carrier plate 6 above the substrate 1. Multiple micro conductive pillars 2 face the first surface 11 of the substrate 1, and the position of each micro conductive pillar 2 is aligned with the position of the corresponding micro hole 13.

[0045] The laser module 75 is electrically connected to the management module 71. The laser module 75 is excited by a laser beam and projects onto the carrier plate 6 to remove the adhesive layer 3 located under each micro conductive post 2, so that each micro conductive post 2 falls into each micro hole 13.

[0046] The coating module 76 is an electrical connection management module 71. The coating module 76 is used to coat conductive adhesive 4 onto the first surface 11, filling the gap between each micro-conductive post 2 and its corresponding micro-pore 13. According to some embodiments, the coating module 76 coats the conductive adhesive 4 using a spin coating method. According to other embodiments, the coating module 76 can also coat back and forth, allowing for large-area coating of the conductive adhesive.

[0047] In the embodiment shown in Figure 19, a grinding module 77 and an electrical connection management module 71 are also included. The grinding module 77 grinds and flattens at least one of the first surface 11 and the second surface 12. As shown in Figure 8, both ends of each micro conductive post 2 are flush with the first surface 11 and the second surface 12, respectively.

[0048] Referring again to Figure 9, the device 7 for transferring a large number of micro-conductive pillars also includes a spraying module 78, which is electrically connected to the management module 71. The spraying module 78 is used to spray a heat dissipation layer 5 onto the first surface 11 of the substrate 1, and the heat dissipation layer 5 covers a plurality of micro-conductive pillars 2. In some embodiments, the spraying module 78 deposits the heat dissipation layer 5 onto the first surface 11 of the substrate 1 by sputtering.

[0049] Referring again to Figures 11 to 18, in another embodiment, each micro-conductive pillar includes a body 21 and a substrate 22. Multiple substrates 22 are located on the adhesive layer 3, and the width of each substrate 22 is larger than the aperture of each micro-hole 13. Multiple micro-conductive pillars 2 (body 21) face the first surface 11 of the substrate 1. The laser module 75 is excited by a laser beam and projects a carrier plate 6 to remove the adhesive layer 3 located below each substrate 22, causing each micro-conductive pillar 2 to fall into each micro-hole 13. At this time, each substrate 22 protrudes from each micro-hole 13. The coating module 76 coats conductive adhesive 4 onto the second surface 12, filling the gap between each body 21 and the corresponding micro-hole 13. The grinding module 77 grinds and flattens the first surface 11 and the second surface 12, removes each substrate 22 and the conductive adhesive 4, so that both ends of each body 21 are flush with the first surface 11 and the second surface 12, respectively. Therefore, it is also possible to complete the process of simultaneously transferring a large number of micro conductive pillars.

[0050] [Beneficial Effects of the Examples]

[0051] In one embodiment of the method for simultaneously transferring a large number of micro conductive pillars according to the present invention, a large number of micro conductive pillars can be transferred, thereby improving the efficiency of the packaging process.

[0052] In one embodiment of the method for simultaneously transferring a large number of micro conductive pillars according to the present invention, a heat dissipation layer may be provided to improve the heat dissipation effect of the packaging structure.

[0053] In one embodiment of the device for simultaneously transferring a large number of micro conductive pillars according to the present invention, the device can perform a large-scale transfer of micro conductive pillars through the operation of modules such as management module, opening module, mounting module, positioning module, laser module and coating module, thereby improving the efficiency of the packaging process.

[0054] The content disclosed above is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention specification and drawings are included in the scope of the patent application of the present invention.

[0055] 100, 200: Methods for Simultaneous Mass Transfer of Microconductive Posts 1:Substrate 11: First Surface 12: Second Surface 13: Micropores 131: First aperture 132: Second aperture 133: Aperture 2: Miniature conductive pillars 21:Ontology 22: Base 3: Adhesive layer 4: Conductive adhesive 5: Heat dissipation layer 6-carrier board 7: Equipment for simultaneously transferring a large number of miniature conductive pillars 71: Management Module 72: Opening Module 73: Install Module 74: Positioning Module 75: Laser Module 76: Coating Module 77: Grinding Module S1-S9: Steps P1-P9: Steps

Claims

1. A method for simultaneously transferring a large number of micro-conductive pillars, comprising: A substrate is provided, having a first surface and a second surface opposite to each other; A plurality of micro-holes are formed on the substrate, wherein a first aperture of each micro-hole on the first surface is larger than a second aperture of each micro-hole on the second surface; a carrier plate is provided, and an adhesive layer is disposed on one surface of the carrier plate; a plurality of micro-conductive pillars are disposed on the adhesive layer, the position of each micro-conductive pillar corresponds to the position of each micro-hole, and the cross-sectional area of ​​one end of each micro-conductive pillar is less than or equal to the first aperture and greater than the second aperture; the carrier plate is placed above the substrate, the plurality of micro-conductive pillars face the first surface of the substrate, and the position of each micro-conductive pillar is aligned with the position of the corresponding micro-hole; the carrier plate is excited by a laser beam to remove the adhesive layer located below each micro-conductive pillar, so that each micro-conductive pillar falls into each micro-hole; and a conductive adhesive is coated on the first surface to fill the gap between each micro-conductive pillar and the corresponding micro-hole.

2. A method for simultaneously transferring a large number of micro-conductive pillars, comprising: A substrate is provided, having a first surface and a second surface opposite to each other; Multiple micropores are formed on the substrate; A carrier plate is provided, and an adhesive layer is disposed on one surface of the carrier plate; a plurality of micro-conductive pillars are disposed on the adhesive layer, each of the micro-conductive pillars being positioned corresponding to the position of each of the micro-holes, each of the micro-conductive pillars including a body and a substrate, the plurality of substrates being located on the adhesive layer, and the width diameter of each of the substrates being larger than the aperture of each of the micro-holes; the carrier plate is placed above a substrate, the plurality of bodies facing the first surface of the substrate, and each of the micro-conductive pillars is aligned with the corresponding micro-hole; the carrier plate is excited by a laser beam to remove the adhesive layer located under each of the substrates, so that each of the micro-conductive pillars falls into each of the micro-holes, and each of the substrates protrudes from each of the micro-holes; and a conductive adhesive is coated on a second surface to fill the gap between each body and the corresponding micro-hole.

3. The method for simultaneously transferring a large number of micro-conductive pillars as described in claim 1 or 2, further comprising performing a grinding step to grind flat at least one of the first surface and the second surface.

4. The method for simultaneously transferring a large number of micro-conductive pillars as described in claim 3, further comprising, after performing the grinding step, disposing a heat dissipation layer on the first surface or the second surface of the substrate.

5. A method for simultaneously transferring a large number of microconductive pillars as described in claim 1 or 2, wherein, The substrate is a glass substrate or a diamond substrate.

6. A method for simultaneously transferring a large number of microconductive pillars as described in claim 1 or 2, wherein, In the plurality of micropores, the space inside each micropore may be the same, or all of them may be different, or some may be the same and others may be different.

7. An apparatus for simultaneously transferring a large number of micro-conductive pillars, comprising: One management module; An opening module, electrically connected to the management module, is used to open a plurality of micro-holes on a substrate. The substrate has a first surface and a second surface facing each other, wherein a first aperture of each micro-hole on the first surface is larger than a second aperture of each micro-hole on the second surface; a mounting module, electrically connected to the management module, is used to place a plurality of micro-conductive pillars on an adhesive layer laid on a carrier plate. The adhesive layer is laid on a carrier plate, and the position of each micro-conductive pillar corresponds to the position of each micro-hole. The cross-sectional area of ​​one end of each micro-conductive pillar is less than or equal to the first aperture and greater than the second aperture; a positioning module, electrically connected to the management module, is used to place the carrier plate above the substrate. The plurality of micro-conductive pillars face the first surface of the substrate, and the position of each micro-conductive pillar is aligned with the position of the corresponding micro-hole. A laser module electrically connected to the management module, the laser module being excited by a laser beam to project the carrier plate to remove the adhesive layer located under each of the micro-conductive pillars, so that each of the micro-conductive pillars falls into each of the micro-pores; and a coating module electrically connected to the management module, the coating module being used to coat a conductive adhesive on the first surface, so that the conductive adhesive fills the gap between each of the micro-conductive pillars and the corresponding micro-pores.

8. An apparatus for simultaneously transferring a large number of micro-conductive pillars, comprising: One management module; An opening module, electrically connected to the management module, is used to open a plurality of micro-holes on a substrate, the substrate having a first surface and a second surface opposite to each other; a mounting module, electrically connected to the management module, is used to place a plurality of micro-conductive pillars on an adhesive layer, the adhesive layer being laid on a carrier plate, the position of each micro-conductive pillar corresponding to the position of each micro-hole, each micro-conductive pillar including a body and a substrate, a plurality of substrates being located on the adhesive layer, the width diameter of each substrate being larger than the aperture of each micro-hole; a positioning module, electrically connected to the management module, is used to place the carrier plate above the substrate, the plurality of micro-conductive pillars facing the first surface of the substrate, the position of each micro-conductive pillar being aligned with the position of the corresponding micro-hole. A laser module is electrically connected to the management module. The laser module is excited by a laser beam and projects the carrier plate to remove the adhesive layer located under each of the substrates, so that each of the micro conductive pillars falls into each of the micropores and each of the substrates protrudes from each of the micropores. And a coating module electrically connected to the management module, the coating module being used to coat a conductive adhesive on the second surface, so that the conductive adhesive fills the gap between each of the bodies and the corresponding micropores.

9. The apparatus for simultaneously transferring a large number of micro-conductive pillars as described in claim 7 or 8, further comprising a grinding module electrically connected to the management module, the grinding module grinding and smoothing at least one of the first surface and the second surface.

10. The apparatus for simultaneously and in large quantities transferring micro-conductive pillars as described in claim 9, further comprising a spraying module for spraying a heat dissipation layer onto the first surface or the second surface of the substrate.

11. An apparatus for simultaneously and massively transferring micro-conductive pillars as described in claim 7 or 8, wherein, The substrate is a glass substrate or a diamond substrate.

12. An apparatus for simultaneously and massively transferring micro-conductive pillars as described in claim 7 or 8, wherein, In the plurality of micropores, the space inside each micropore may be the same, or all of them may be different, or some may be the same and others may be different.

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