Electronic device and method for manufacturing the same

TW202637017APending Publication Date: 2026-09-01ADVANCED SEMICON ENG INC
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Patent Information

Application Number
TW114151398
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-08-29
Filing Date
2025-12-26
Publication Date
2026-09-01

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Abstract

An embodiment of the present disclosure relates to an electronic device. The electronic device includes a redistribution layer (RDL) having a first surface and a second surface opposite the first surface, an electronic component disposed over the first surface of the RDL, and a reinforcement layer disposed over the second surface of the RDL. Another embodiment of the present disclosure relates to a method for manufacturing an electronic device.
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