Semiconductor sealing resin sheet, resin-sealed semiconductor device and manufacturing method thereof

TW202637019APending Publication Date: 2026-09-01KYOCERA CORP
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Patent Information

Application Number
TW114150727
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-23
Filing Date
2025-12-23
Publication Date
2026-09-01

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Abstract

The semiconductor sealing resin sheet of the present invention comprises (A) epoxy resin, (B) phenolic resin curing agent, (C) curing accelerator, and (D) inorganic filler, wherein the content of (D) inorganic filler is 60.0 to 87.0% by mass, and the cumulative volume 50% particle size (D50) is 0.3 to 5.0 μm.
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