Carrier structure

Abstract

A carrier structure is defined with an adjacent main area and a peripheral area, so that a plurality of substrate unit are arranged in the main area, and a plurality of electrical connection pads are provided on each substrate unit and at least two inspection pads are arranged in the peripheral area, so that when the surface treatment layer is formed on the electrical connection pads and the inspection pads, the mutual contact status of the surface treatment layer formed on the two inspection pads can be directly observed to determine whether the surface treatment layer formed on the electrical connection pad reaches the target thickness.

Claims

1. A load-bearing structure, defining an adjacent main area and an outer area, comprising: A plurality of substrate units are disposed in the main body area, and each of the plurality of substrate units has a plurality of electrical connection pads; And at least two inspection pads are disposed in the peripheral area, wherein the distance between the at least two inspection pads is less than the distance between any two of the plurality of electrical connection pads, wherein the peripheral area is provided with a plurality of groups of inspection pads, each group of inspection pads includes two inspection pads, and the distance between the two inspection pads in each group is the same.

2. A load-bearing structure, defining an adjacent main area and an outer area, comprising: A plurality of substrate units are disposed in the main body area, and each of the plurality of substrate units has a plurality of electrical connection pads; And at least two inspection pads are disposed in the peripheral area, wherein the distance between the at least two inspection pads is less than the distance between any two of the plurality of electrical connection pads, wherein the peripheral area is provided with a plurality of groups of inspection pads, each group of inspection pads includes two inspection pads, and the distance between the two inspection pads in each group is different.

3. The support structure as described in claim 1 or 2 further includes a surface treatment layer formed on the plurality of electrical connection pads and the at least two inspection pads.

4. The load-bearing structure as described in claim 3, wherein, The surface treatment layer is a nickel / gold layer.

5. The support structure as described in claim 1 or 2 is a whole-page or strip-shaped structure, and the plurality of substrate units are arranged in an array.

6. The load-bearing structure as described in claim 1 or 2, wherein, The substrate unit provides an electronic component on which the electronic component is electrically connected to the plurality of electrical connection pads.

7. The load-bearing structure as described in claim 6, wherein, Each of these substrate units has a cutting path that serves as a slitting process.

8. The load-bearing structure as described in claim 1 or 2, wherein, The outer perimeter is connected to the main perimeter and is located on the periphery of the main perimeter.

9. The load-bearing structure as described in claim 1 or 2, wherein, The inspection pad is made of the same material as the electrical connection pad.

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