Substrate processing apparatus and substrate processing method

TW202637288APending Publication Date: 2026-09-16SCREEN HOLDINGS CO LTD
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Patent Information

Application Number
TW115108870
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-12
Filing Date
2026-03-11
Publication Date
2026-09-16

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Abstract

A substrate processing apparatus is provided that can uniformly supply processing liquid to a substrate. The substrate processing apparatus (100) includes: a first processing liquid ejection pipe (41) that generates the flow of processing liquid inside a processing tank (2); a second processing liquid ejection pipe (42) that generates the flow of processing liquid inside the processing tank by changing the flow direction of the processing liquid generated by the first processing liquid ejection pipe; and a control unit that changes the ejection of processing liquid from the second processing liquid ejection pipe during the period when the processing liquid is ejected from the first processing liquid ejection pipe.
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