Binder system, mold material mixture comprising the binder system and method for manufacturing molds or cores using the mold material mixture

TW202637295APending Publication Date: 2026-09-16FOSECO INTERNATIONAL LTD
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Patent Information

Application Number
TW114144693
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-20
Filing Date
2025-11-20
Publication Date
2026-09-16

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Abstract

The present invention discloses a mold material mixture for the manufacture of molds and cores for metal processing. Said mold material mixture comprises a refractory based mold material and a binder system. Said binder system comprises a liquid portion and a solid portion. Said liquid portion comprises an inorganic binder and water. The inorganic binder is a mixture of sodium silicate and potassium silicate. Said solid portion comprises particulate amorphous SiO₂, said particulate amorphous SiO₂ having a BET specific surface area of
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