Binder system, mold material mixture comprising the binder system and method for manufacturing molds or cores using the mold material mixture
TW202637295APending Publication Date: 2026-09-16FOSECO INTERNATIONAL LTD
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Patent Information
- Application Number
- TW114144693
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-11-20
- Filing Date
- 2025-11-20
- Publication Date
- 2026-09-16
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Figure TWG2TA001076442_001 
Figure TWG2TA001076442_002
Abstract
The present invention discloses a mold material mixture for the manufacture of molds and cores for metal processing. Said mold material mixture comprises a refractory based mold material and a binder system. Said binder system comprises a liquid portion and a solid portion. Said liquid portion comprises an inorganic binder and water. The inorganic binder is a mixture of sodium silicate and potassium silicate. Said solid portion comprises particulate amorphous SiO₂, said particulate amorphous SiO₂ having a BET specific surface area of
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