Conductive joint, method for manufacturing a conductive joint, and method for bonding a first substrate and a second substrate

TW202637298APending Publication Date: 2026-09-16SENJU METAL IND CO LTD
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Patent Information

Application Number
TW114147571
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-05
Filing Date
2025-12-04
Publication Date
2026-09-16

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Abstract

The present invention aims to provide a conductive joint that exhibits excellent conductivity both initially and after electromigration (EM) testing. Provided as a solution in the present invention is a conductive joint comprised of a first substrate; a second substrate; a core material having electrical conductivity and positioned between the first substrate and the second substrate; and a solder present at a position where the first substrate, the second substrate, and the core material are joined, the solder containing
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