Laser processing machine, laser processing control device and laser processing method

Abstract

This invention enables laser processing to achieve the desired processing quality from the start of the process, resulting in lower variations in processing quality due to variations in the workpiece location compared to conventional laser processing machines. The laser processing machine includes: a laser oscillator, a laser processing unit, a processing control unit 31, and a power control unit 32. The processing control unit calculates the distance between holes from the processing formula, and then calculates main discharge time control information from the hole distance to ensure that the laser pulse energy does not change due to variations in the laser pulse output frequency. The power control unit controls the laser oscillator based on the main discharge time control information during hole processing using the processing formula.

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