Laser dicing apparatus
TW202637309APending Publication Date: 2026-09-16TOKYO SEIMITSU CO LTD
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Patent Information
- Application Number
- TW115104569
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-11-26
- Filing Date
- 2026-02-05
- Publication Date
- 2026-09-16
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Abstract
A laser dicing apparatus includes a laser light source that outputs a beam, at least one lens provided on an optical path of the beam, a diffractive optical element provided in a converging / diverging region on the optical path where the beam converges or diverges due to an action of the lens and configured to split the beam, and a moving mechanism that moves the diffractive optical element along an optical axis of the beam in the converging / diverging region.
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