Polishing method and polishing apparatus

Abstract

A polishing method and polishing apparatus are provided to improve the flatness of the bonding surface used to form a laminated substrate. The polishing method includes: measuring the shape of the periphery of a substrate (W1) having a bonding surface (S1) for forming a laminated substrate (Ws), the bonding surface (S1) including the surface of a device region (1a) and the surface of an insulating film (1b) formed on the periphery and raised from the device region (1a); determining a polishing recipe including the variation of the moving speed of a polishing head (10) from a polishing start position to a polishing end position, based on the measured shape of the periphery; and, according to the determined polishing recipe, moving the polishing head (10) along the radial direction of the substrate (W1) while pressing a polishing workpiece (12) against the periphery of the rotating substrate (W1) by the polishing head (10) to polish the insulating film (1B) and flatten the bonding surface (S1).

Images