Functionalized pads for chemical planarization

Abstract

Examples are disclosed that relate to a pad for performing abrasive-free chemical planarization of a substrate. The pad comprises a polymer layer configured to contact the substrate during the abrasive-free chemical planarization. The polymer layer comprises a plurality of reactive units covalently bonded within polymer chains. Each reactive unit comprises a functional group comprising one or more of a complexing agent or a hydrolyzing agent for performing the abrasive-free chemical planarization. The polymer layer comprises a plurality of molded grooves each containing turbulence-creating structures configured to cause turbulence in a planarization solution within the grooves during a planarization process.

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