Conditioner and manufacturing method thereof

TW202637328APending Publication Date: 2026-09-16YTDIAMOND
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Patent Information

Application Number
TW115105572
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-14
Filing Date
2026-02-12
Publication Date
2026-09-16

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    Figure TWG2TA001077194_003
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Abstract

A conditioning assembly and its manufacturing method. The conditioning assembly includes a base and a grinding structural member. The grinding structural member includes a support structure layer, a first bonding layer, a plurality of abrasive particles, a second bonding layer, and an infiltration composite layer. The support structure layer has a first surface and a second surface opposite to each other. The first bonding layer is disposed on the first surface. The plurality of abrasive particles are disposed on the first surface in a single-layer arrangement, and the plurality of abrasive particles are bonded to the support structure through the first bonding layer. The second bonding layer is disposed on the second surface. The infiltration composite layer is disposed on the second surface and is bonded to the support structure through the second bonding layer. The base and the grinding structural member are bonded together through a third bonding layer.
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