Dressing structural member, conditioner, and manufacturing method thereof

Abstract

A dressing structural member, a conditioner and a method for manufacturing the conditioner are provided. The conditioner includes a substrate and the dressing structural member, and the dressing structural member is fixed on the substrate. The dressing structural member includes a grinding structure layer, a supporting structure layer and a brazing filler layer. The grinding structure layer includes a first infiltrated composite layer and a plurality of first abrasive particles. The first infiltrated composite layer has a grinding surface and a first bonding surface that are opposite to each other. The plurality of first abrasive particles are dispersedly embedded onto the grinding surface of the first infiltrated composite layer, and each of the first abrasive particles is partially exposed on the grinding surface. The supporting structure layer has a second bonding surface, and the second bonding surface faces the first bonding surface. The brazing filler layer is disposed between the first bonding surface and the second bonding surface and is used to bond the first infiltrated composite layer to the supporting structure layer.

Description

Technical Field

[0001] This invention relates to a grinding structure, a dresser, and a method for manufacturing the dresser, and particularly to a grinding structure, a dresser, and a method for manufacturing the dresser suitable for dressing polishing pads. Prior Technology

[0002] In chemical-mechanical polishing (CMP) processes or high-precision polishing processes, polishing pads are typically used in conjunction with polishing slurries to polish the surfaces of workpieces such as semiconductor wafers, optical components, or glass. Generally, the surface of the polishing pad is dressed using a conditioner. The conditioner uses its abrasive layer to remove waste material remaining on the polishing pad during polishing and restores the roughness of the polishing pad to maintain stable polishing quality.

[0003] In existing technologies, a brazed process is used to fix abrasive particles (e.g., diamond abrasive particles) onto the substrate of the dresser (e.g., a stainless steel substrate). However, during the brazing process, from high-temperature welding to cooling and fixing, the cooling rate at the center and edge of the substrate differs, and the thermal expansion coefficients of the solder and the metal substrate are also different. This causes the dresser (a structure composed of substrate, solder, and abrasive particles) to easily warp (or bend), and the degree of warping is difficult to control, adversely affecting subsequent processing. Another existing technology involves pre-sintering to form an abrasive sheet (a structure composed of an abrasive layer, solder, and abrasive particles) and then bonding it to the metal substrate. Because the pre-sintered abrasive sheet has high rigidity, if the warping is too large, applying external pressure to force the bent solder sheet (formed by the cooling and fixing of the solder) to flatten and adhere to the substrate of the dresser may cause cracking of the solder sheet structure, leading to the abrasive particles falling off. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a grinding structure, a dressing device, and a method for manufacturing the dressing device in order to address the shortcomings of the prior art. This invention can prevent the dressing device from deforming due to high temperature thermal stress, effectively control the grinding structure to achieve the expected warping direction and the expected warping range, and also solve the problem of surface cracks caused by welding thermal stress.

[0005] To address the aforementioned technical problems, one technical solution adopted by this invention is to provide a grinding structure, comprising a grinding structure layer, a support structure layer, and a welding layer. The grinding structure layer includes a first infiltration composite layer and a plurality of first grinding particles. The first infiltration composite layer has a grinding surface and a first bonding surface located on opposite sides, with the plurality of first grinding particles dispersedly embedded in the grinding surface of the first infiltration composite layer, each first grinding particle being partially exposed. The support structure layer has a second bonding surface facing the first bonding surface. The welding layer is disposed between the first bonding surface and the second bonding surface and is used to bond the first infiltration composite layer and the support structure layer.

[0006] To address the aforementioned technical problems, another technical solution adopted by the present invention is to provide a dressing device, which includes a base and the aforementioned grinding structure. The grinding structure is disposed on the base.

[0007] To solve the above-mentioned technical problems, another technical solution adopted by the present invention is to provide a method for manufacturing a dressing device, which includes the following steps: providing a first porous structure layer, embedding a plurality of first abrasive particles in a grinding surface of the first porous structure layer, each first abrasive particle being partially exposed on the grinding surface; setting a metal solder on a first bonding surface of the first porous structure layer, the first bonding surface and the grinding surface being located on opposite sides of the first porous structure layer; providing a support structure layer, and contacting the metal solder with a second bonding surface of the support structure layer, so that the metal solder is located between the first bonding surface and the second bonding surface; and performing a high-temperature hard soldering process to melt the metal solder, so that the molten metal solder infiltrates into the first porous structure layer to form a first infiltrated composite layer, and bonding with the plurality of first abrasive particles, while the molten metal solder bonds with the first infiltrated composite layer and the support structure layer to form a grinding structure.

[0008] One of the beneficial effects of this invention is that the grinding structure, dressing tool, and method for manufacturing the dressing tool provided by this invention can utilize a grinding structure layer, a support structure layer, and a welding layer to assemble the grinding structure. One side of the welding layer is a grinding structure layer with a low coefficient of thermal expansion, while the other side of the welding layer can be a support structure layer with a high coefficient of thermal expansion. Since the compressive stress of the grinding structure layer can generate a downward warping moment, while the contraction tensile stress of the support structure layer can generate an upward warping moment, the final degree of warping will be determined by the combined effect of these moments. Therefore, this invention can control the degree of warping of the welded grinding structures M1 to M3 to achieve the desired direction and amplitude by configuring the grinding structure layer and the support structure layer.

[0009] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are for reference and illustration only and are not intended to limit the present invention. Simple Explanation of the Diagram

[0010] Figure 1 is a schematic diagram of the grinding structure according to the first embodiment of the present invention.

[0011] Figure 2 is a schematic diagram of the manufacturing process of the grinding structure component according to the first embodiment of the present invention.

[0012] Figure 3 is a schematic diagram of the warping of the grinding structure component according to the first embodiment of the present invention.

[0013] Figure 4 is a schematic diagram of the grinding structure fixed on the base according to the first embodiment of the present invention.

[0014] Figure 5 is a schematic diagram of the trimmer according to the first embodiment of the present invention.

[0015] Figure 6 is a schematic diagram of another state of the trimmer according to the first embodiment of the present invention.

[0016] Figure 7 is a schematic diagram of the grinding structure according to the second embodiment of the present invention.

[0017] Figure 8 is a schematic diagram of the trimmer according to the second embodiment of the present invention.

[0018] Figure 9 is a schematic diagram of the grinding structure according to the third embodiment of the present invention.

[0019] Figure 10 is a schematic diagram of the trimmer according to the third embodiment of the present invention. Implementation

[0020] The following specific embodiments illustrate the implementation of the "grinding structure, dresser, and method for manufacturing the dresser" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions of actual dimensions, as stated in advance. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention. In addition, it should be understood that although terms such as "first," "second," and "third" may be used herein to describe various elements, these elements should not be limited by these terms. These terms are mainly used to distinguish one element from another. Furthermore, the term "or" used herein may, depending on the actual situation, include any combination of one or more of the associated listed items.

[0021] [First Embodiment]

[0022] Referring to Figure 1, which is a schematic diagram of a grinding structure according to a first embodiment of the present invention, the grinding structure M1 includes a grinding structure layer 1, a support structure layer 2, and a welding layer 3. The welding layer 3 is disposed between the grinding structure layer 1 and the support structure layer 2. The grinding structure layer 1 includes a first infiltration composite layer 11 and a plurality of first grinding particles 12. The first infiltration composite layer 11 has grinding surfaces 111 and first bonding surfaces 112 located on opposite sides (see Figure 2 for reference). The plurality of first grinding particles 12 are dispersedly embedded in the grinding surfaces 111 of the first infiltration composite layer 11, and each first grinding particle 12 is partially exposed. Specifically, at least half of the volume of each first grinding particle 12 is embedded in the grinding surface 111 of the first infiltration composite layer 11. The first infiltration composite layer 11 is formed by the infiltration of a first portion B1 of metal solder B into the interior of a first porous structure layer 113.

[0023] The supporting structure layer 2 has a second bonding surface 20 (see Figure 2 for reference), which faces the first bonding surface 112. A welding layer 3 is disposed between the first bonding surface 112 and the second bonding surface 20, and is used to bond the first infiltration composite layer 11 and the supporting structure layer 2. In a first embodiment, the supporting structure layer 2 may include a second infiltration composite layer 21, and the second bonding surface 20 is the surface of the second infiltration composite layer 21 facing the welding layer 3. The second infiltration composite layer 21 is formed by the infiltration of a second portion B2 of the metal solder B into the interior of the second porous structure layer 213. The first porous structure layer 113 and the second porous structure layer 213 are metallic porous structures. For example, the materials of the first porous structure layer 113 and the second porous structure layer 213 may be, for example, but not limited to: nickel, iron, copper, titanium, molybdenum, cobalt, chromium, stainless steel, nickel alloys, iron alloys, copper alloys, and titanium alloys. Furthermore, the first porous structure layer 113 and the second porous structure layer 213 may be (but are not limited to): a mesh structure, a foamed structure, a fiber structure, or a fin structure. In a preferred embodiment, the first porous structure layer 113 and the second porous structure layer 213 may be composed of foamed nickel or its alloy, such as foamed nickel (or nickel foam). In other embodiments, the first porous structure layer 113 and the second porous structure layer 213 may also be composed of foamed titanium or foamed stainless steel, or nickel fibers. It should also be noted that in this invention, the first porous structure layer 113 and the second porous structure layer 213 may be a single-layer structure or a multi-layer structure, and this invention is not limited thereto.

[0024] Additionally, for example, the first porous structure layer 113 and the second porous structure layer 213 can be manufactured by powder metallurgy, hot extrusion, molten metal method, electroplating, electrochemical deposition, or casting. The surface and interior of the first porous structure layer 113 have a plurality of first pores V1, and the surface and interior of the second porous structure layer 213 have a plurality of second pores V2. For example, the porosity of the first porous structure layer 113 is about 10% to 50%, and the porosity of the second porous structure layer 213 is about 20% to 95%. Furthermore, the first abrasive particles 12 may include single-crystal diamond, polycrystalline diamond, polycrystalline diamond (PCD), CVD diamond, diamond, cubic boron nitride (cBN) particles, silicon carbide particles, or any combination thereof.

[0025] The solder layer 3 is made of a metallic solder B. The material of the metallic solder B includes metal alloys, preferably, for example, nickel-based alloys (BNi-2). In addition, the form of the metallic solder B can be solder sheet, solder paste, solder powder, or a mixture of solder powder and resin. The present invention does not limit the form of the metallic solder B. The metallic solder B forms a molten state in a high-temperature vacuum environment. The first part B1 of the molten metallic solder B (the first part B1 is the dot area located in the first porous structure layer 113 in FIG. 1) will melt into the first porous structure layer 113 through the first pores V1 by capillary force, and form a first melt-infiltrated composite layer 11 after cooling and solidification, and combine with the first abrasive particles 12. The other part of the metallic solder B that has not penetrated into the first porous structure layer 113 forms the solder layer 3 after cooling and solidification. Similarly, the second part B2 of the metal solder B (the second part B2 is the dot area located in the second porous structure layer 213 in Figure 1) will melt into the second porous structure layer 213 through the second pore V2 by capillary force, and after cooling, it will combine to form the second melt-infiltrated composite layer 21.

[0026] It should be noted that the first part B1 of the metal solder B will melt and fill (or penetrate) the grinding surface 111 of the first melt-infiltrated composite layer 11 (the grinding surface 111 may not be completely filled, and there will be some small pits on the surface due to surface tension). However, the second part B2 does not necessarily have to fill the second pores V2 inside the entire second porous structure layer 213. That is, the second part B2 can be completely filled or partially filled. As shown in Figure 1, in a preferred embodiment of the present invention, the second part B2 partially fills the second pores V2 of the second porous structure layer 213, and the part of the second porous structure layer 213 that is not filled by the second part B2 of the metal solder B can serve as a compressible elastic layer (because this part is not filled by the metal solder B and is compressible), so that the overall height of the grinding structure M1 can be adjusted and the flatness of the grinding structure M1 can be maintained in the subsequent step (the grinding structure M1 is bonded to the base). (The elastic layer can absorb the height difference of the uneven parts of the base and maintain the overall flatness.)

[0027] Furthermore, in the grinding structure M1 provided by this invention, the equivalent coefficient of thermal expansion of the grinding structure layer 1 (including the first infiltration composite layer 11 and a plurality of first grinding particles 12) is less than or equal to the equivalent coefficient of thermal expansion of the support structure layer 2. Even further, the composite structure formed by the grinding structure layer 1 and the first portion B1 of the metal solder B has a coefficient of thermal expansion that is less than or equal to the coefficient of thermal expansion of the composite structure formed by the support structure layer 2, the second portion B2 of the metal solder B, and the welding layer 3. It should also be noted that the size of the first pore V1 in the first infiltration composite layer 11 shown in Figure 1, and the size of the second pore V2 in the second infiltration composite layer 21, are not limited by this invention; the pore sizes shown in Figure 1 are for illustrative purposes only. Furthermore, the first fusion infiltration composite layer 11 and the second fusion infiltration composite layer 21 differ in thickness, as shown in Figure 1. In a preferred embodiment, the thickness H1 of the first fusion infiltration composite layer 11 is 0.05 mm to 0.5 mm, and the thickness H2 of the second fusion infiltration composite layer 21 is 0.1 mm to 1 mm. In other words, the average thickness of the second fusion infiltration composite layer 21 is greater than the average thickness of the first fusion infiltration composite layer 11. Additionally, the thickness H3 of the weld layer 3 is 0.005 mm to 0.1 mm.

[0028] Next, the manufacturing process of the grinding structure M1 will be further explained. Referring to Figures 1 and 2, Figure 2 is a schematic diagram of the manufacturing process of the grinding structure according to the first embodiment of the present invention.

[0029] First, as shown in step S1 of Figure 2, a first porous structure layer 113 is provided, and multiple first abrasive particles 12 are embedded in the abrasive surface 111 of the first porous structure layer 113. Each first abrasive particle 12 will have a portion exposed on the abrasive surface 111. The arrangement direction and exposure height of the first abrasive particles 12 can be fixed by the first porous structure layer 113, so that the exposure height of the multiple first abrasive particles 12 is controlled at the same horizontal level. In addition, the first porous structure layer 113 can also control and fix the arrangement direction of the first abrasive particles 12, so that the first abrasive particles 12 will not flip over due to the high temperature boiling of the metal solder B in the subsequent hard soldering process.

[0030] Next, as shown in step S2 of Figure 2, a stacked structure is formed between the metal solder B, the second porous structure layer 213, and the first porous structure layer 113. The first porous structure layer 113 contacts the metal solder B with its first bonding surface 112, while the second porous structure layer 213 contacts the metal solder B with its second bonding surface 20, such that the metal solder B is located between the first bonding surface 112 and the second bonding surface 20.

[0031] Next, as shown in step S3 of Figure 2, the stacked structure consisting of the first abrasive particles 12, the first porous structure layer 113, the metal solder B, and the second porous structure layer 213 is placed in a high-temperature vacuum furnace (not shown) for a hard soldering process. The metal solder B is subjected to high temperatures (e.g., above 1000 degrees Celsius) in the high-temperature vacuum furnace and melts to form a molten state. The first portion B1 of the metal solder B penetrates into the first porous structure layer 113 and combines with it to form a first melt-penetration composite layer 11, which in turn combines with multiple first abrasive particles 12 to form the abrasive structure layer 1. The second portion B2 of the metal solder B penetrates into the second porous structure layer 213 and combines with it to form a second melt-penetration composite layer 21 (i.e., the support structure layer 2). The portions of the metal solder B that do not penetrate the first porous structure layer 113 and the second porous structure layer 213 solidify after cooling to form a welding layer 3. Thus, the welding layer 3, the support structure layer 2, and the abrasive structure layer 1 form the abrasive structure component M1. In addition, when performing the hard welding process in a high-temperature vacuum furnace, a pressure plate P can be placed on top of the stacked structure to make the sintering of the grinding structure M1 more stable.

[0032] It is also worth mentioning that the first portion B1 of the metal solder B that penetrates into the first porous structure layer 113 covers the first bonding surface 112 of the first porous structure layer 113 (see Figure 2), while the second portion B2 of the metal solder B that penetrates into the second porous structure layer 213 covers the second bonding surface 20 of the second porous structure layer 213. Furthermore, a residual solder interface layer (i.e., the solder layer 3 in Figure 2) of the metal solder B will remain between the first fusion composite layer 11 and the second fusion composite layer 21. In other words, the metal solder B will act as a barrier between the first fusion composite layer 11 and the second fusion composite layer 21, preventing the first pore V1 in the first fusion composite layer 11 and the second pore V2 in the second fusion composite layer 21 from communicating with each other.

[0033] It should be noted that during the hard soldering process, the polishing structure M1 can be placed with the polishing structure layer 1 facing downwards, that is, with the side containing the first polishing particles 12 facing downwards on the support platform (not shown in the figure) inside the high-temperature vacuum furnace. Therefore, the first part B1 of the metal solder B will not only be affected by capillary force, but also by gravity (and even the pressure applied by the pressure plate P) to penetrate into the first porous structure layer 113, ensuring that the stress of the polishing structure M1 can be evenly distributed.

[0034] Existing grinding structures generally only include grinding particles 12, grinding structure layer 1, and welding layer 3, but not support structure layer 2, thus making it impossible to control the change in the coefficient of thermal expansion. The first grinding particle 12, for example, is diamond, with a linear coefficient of thermal expansion (CTE) of approximately 1.0 × 10⁻⁶ / °C at 1000°C. The metal solder B of welding layer 3, for example, is a nickel-based alloy (BNi-2), with a linear coefficient of thermal expansion of approximately 13.5 × 10⁻⁶ / °C at 1000°C. Pure nickel has a linear coefficient of thermal expansion of approximately 16.2 × 10⁻⁶ / °C at 1000°C. The first porous structure layer 113 constituting grinding structure layer 1 is made of, for example, nickel foam. Nickel foam itself has a porous structure with a porosity of approximately 30%, so the solid portion of nickel foam accounts for approximately 70% of the volume. When calculating the equivalent thermal expansion coefficient of the entire grinding structure M1, assuming the thickness H1 of the nickel foam structure (first porous structure layer 113) in Figure 1 is 0.2 mm, and the diamond abrasive grains (first grinding particles 12) penetrate 0.1 mm into the foam, with the penetration area accounting for 50% of the surface area of ​​the nickel foam, then the equivalent thermal expansion coefficient during hard soldering at a high temperature of 1000°C can be obtained through the following calculation:

[0035] The coefficient of thermal expansion of the nickel foam structure can be calculated using a volume-weighted average as: (0.7 × 16.2) × 10⁻⁶ / °C = 11.34 × 10⁻⁶ / °C;

[0036] The diamond particle has an insertion depth of 0.1 mm, and the nickel foam structure has a thickness of 0.2 mm. Therefore, the volume percentage of the diamond is approximately (0.1 / 0.2) × 50% = 25%.

[0037] The equivalent coefficient of thermal expansion for a nickel foam structure (75% by volume) and a diamond abrasive (25% by volume) is: ((0.75×11.34)+(0.25×1.0)) ×10⁻⁶ / °C = 8.26×10⁻⁶ / °C;

[0038] Considering the influence of the weld layer 3, for example, the infiltration of a nickel-based alloy (BNi-2), the porosity of the foamed nickel is 30%. Assuming that the nickel-based alloy fills all the first pores V1 after infiltration, the nickel-based alloy accounts for 30% of the total area of ​​the grinding surface 111. Therefore, the equivalent thermal expansion coefficient of the grinding surface 111 is calculated to be: (0.7×8.26)+(0.3×13.5)=9.83×10-6 / °C.

[0039] Although nickel foam is essentially pure nickel, the presence of porosity reduces its overall stiffness, preventing it from expanding exactly according to the coefficient of thermal expansion of pure nickel when heated. With a porosity of approximately 30%, these tiny pores limit the extent of expansion, resulting in a significantly lower coefficient of thermal expansion for nickel foam compared to pure nickel. Thermal expansion is a volumetric effect, but the foam structure reduces effective expansion transfer; therefore, forming nickel foam from pure nickel results in a smaller coefficient of thermal expansion (e.g., from 16.2 × 10⁻⁶ / °C to 11.34 × 10⁻⁶ / °C). Even when nickel-based alloys are incorporated to fill the internal pores of the nickel foam structure, the limiting effects of the nickel foam structure (e.g., coefficient of thermal expansion, mechanical strength, thermal conductivity, etc.) are still retained because the nickel foam structure still constitutes a large portion of the overall structure.

[0040] When thermal expansion occurs, the internal microstructure of a material affects the final expansion behavior. For example, the difference in the coefficients of thermal expansion of heterogeneous materials can lead to internal stress. For instance, nickel-based alloys and nickel foam structures have different coefficients of thermal expansion, so they expand to different degrees when heated. This generates mechanical stress, which inhibits the overall expansion. This effect usually reduces the equivalent coefficient of thermal expansion.

[0041] Nickel foam has low rigidity and is inherently a structure with relatively high flexibility (low mechanical rigidity). Even when nickel-based alloys fill the internal pores of nickel foam, the nickel foam base material still provides a structure with low mechanical rigidity, resulting in a smaller degree of thermal expansion in the filled nickel foam structure compared to pure nickel-based alloys. In other words, when a filler (such as a nickel-based alloy) is incorporated into a porous structure (such as a nickel foam structure), the resulting composite structure still has a smaller coefficient of thermal expansion than the filler itself. This is because the microstructure of the porous structure itself inhibits thermal expansion transfer, and the thermal stress between dissimilar materials reduces the overall coefficient of thermal expansion.

[0042] The equivalent thermal expansion coefficient of the grinding surface 111 of the first infiltrated composite layer 11 is less than or equal to that of the weld layer 3. Therefore, during the cooling and solidification process, the volume shrinkage of the weld layer 3 is greater than or equal to the volume shrinkage of the grinding surface 111. Consequently, the tensile stress generated by the shrinkage of the first infiltrated composite layer 11 on the side forming the weld layer 3 during cooling is greater than or equal to the compressive stress generated by the stretching on the side of the grinding surface 111 during cooling, causing the finished grinding structure to warp due to a downward warping moment.

[0043] On the other hand, referring to step S1 in Figure 2, when the first abrasive particle 12 is too small (e.g., particle size less than 0.1 mm), the thickness of the first porous structure layer 113 cannot be designed to be too large (e.g., the thickness should be less than 0.2 mm). This is because the molten solder B (first part B1) that penetrates into the first porous structure layer 113 can diffuse to the location of the first abrasive particle 12 in a short time, and even diffuse to the abrasive surface 111 of the first porous structure layer 113, thus submerging the first abrasive particle 12. Even if the thickness of the solder layer 3 or the thickness of the first porous structure layer 113 is reduced, although there is a chance to solve the problem of solder submerging the abrasive particles, reducing the thickness of the first porous structure layer 113 or the solder layer 3 will make the overall structure thinner, and it is easy to form a wavy shape due to uneven stress during cooling and solidification, which will affect the quality of subsequent processing. The mechanism by which capillary action drives the molten solder metal into the porous nickel foam is mainly determined by wettability, capillary pressure, surface tension, and diffusion behavior. In order to improve the phenomenon of warping or wavy formation in the ground structure after molding, the present invention provides the following improvement solution.

[0044] The grinding structure M1 of the present invention includes a support structure layer 2, namely the second molten composite layer 21, which increases the rigidity of the grinding structure M1 and reduces the probability of it forming a wavy shape after cooling and solidification. Furthermore, as shown in FIG1, since the support structure layer 2 is formed by the infiltration of molten metal solder B (second part B2) into the second porous structure layer 213, in other words, the amount of metal solder B forming the weld layer 3 is reduced, that is, the thickness of the weld layer 3 is reduced. With a thinner weld layer 3, the volume shrinkage during cooling and solidification is reduced (the resulting tensile stress is reduced), thereby reducing the degree of warping. In addition, the increased flexibility of the entire grinding structure M1 is also beneficial for subsequent leveling and bonding processes.

[0045] However, as mentioned above, since the composite structure formed by the grinding structure layer 1 (first infiltration composite layer 11 and multiple first grinding particles 12) and the first part B1 of the metal solder B has a lower coefficient of thermal expansion than the composite structure formed by the support structure layer 2 and the second part B2 of the metal solder B, the grinding structure M1 after the hard soldering process may still warp. By designing the second infiltration composite layer 21, for example by changing the porosity or thickness of the second porous structure layer 213, the degree and direction of warping of the grinding structure M1 can be appropriately controlled, and even flattening can be achieved.

[0046] Furthermore, once the second porous structure layer 213 is penetrated by the molten metal solder B (second part B2), the amount of metal solder B (first part B1) penetrating into the first porous structure layer 113 will also decrease. In other words, adding the second porous structure layer 213 to the grinding structure M1 can further control the amount of metal solder B penetrating into the first porous structure layer 113 (i.e., control the amount of the first part B1 of metal solder B), and the problem of excessive metal solder B penetrating and submerging the first grinding particles 12 can be solved by using capillary force balance.

[0047] The present invention utilizes the design of different porosities and different thicknesses of the second porous structure layer 213 to control the amount of solder B penetrating into the first porous structure layer 113 and the second porous structure layer 213, as well as the amount of solder forming the welding layer 3, thereby controlling the tensile stress of the welding layer 3, avoiding warping and controlling the warping direction. For example, the average size of the second pore V2 of the second porous structure layer 213 is larger than the average size of the first pore V1 of the first porous structure layer 113, and the thickness of the second porous structure layer 213 is greater than the thickness of the first porous structure layer 113. The capillary force of the second porous structure layer 213 is poor, and the amount of metal solder B penetrating into the second porous structure layer 213 is less than the amount penetrating into the first porous structure layer 113 (that is, the amount of the second part B2 is less than the amount of the first part B1). This makes the amount of solder penetrating into the first porous structure layer 113 more saturated, avoids affecting the bonding force between the first abrasive particles 12 and the first porous structure layer 113, and makes the residual stress after cooling more uniform, the warping less, or even flattened.

[0048] After mitigating the warping amplitude of the grinding structure M1 by configuring the second melt-infiltrated composite layer 21, the resulting grinding structure M1 is shown in Figure 3. Figure 3 is a schematic diagram of the warping of the grinding structure of the first embodiment of the present invention. It should be noted that the grinding structure M1 in Figure 3 is only shown to present a warped appearance (i.e., the middle part protrudes outward relative to the two sides towards the side where the first grinding particles 12 are disposed), so the detailed structure of the grinding structure M1 is omitted and not shown. The detailed structure of the grinding structure M1 can be referred to in Figure 1.

[0049] The manufacturing process of the dressing device of the present invention will be described next. Referring to Figures 4 and 5, Figure 4 is a schematic diagram of the grinding structure component of the first embodiment of the present invention fixed on the base, and Figure 5 is a schematic diagram of the dressing device of the first embodiment of the present invention. A base 4 and an adhesive are provided, and the adhesive is disposed on a mating surface 41 of the base 4 to form an adhesive layer 5. For example, the adhesive may be, for example, a low-temperature metal solder, ceramic, glass, resin, hot melt adhesive or a composite material thereof, and the present invention is not limited thereto. Next, the formed grinding structure component M1 is disposed on the mating surface 41 of the base 4, and the adhesive layer 5 is located between the base 4 and the grinding structure component M1. Next, a high-temperature and high-pressure bonding process is performed (if high temperature is not used, a long time is required for the adhesive layer 5 to cure), and a pressure plate P is provided to press down the grinding structure M1. Part of the adhesive layer 5 will penetrate into the second porous structure layer 213 (the pores in the second porous structure layer 213 also help to generate capillary action to allow the adhesive layer 5 to penetrate), thereby fixing the grinding structure M1 to the base 4 through the adhesive layer 5 to form the dressing device D1.

[0050] Furthermore, the second infiltrated composite layer 21 includes an upper portion 211 and a lower portion 212. The upper portion 211 is where the metal solder B has infiltrated, while the lower portion 212 is where the metal solder B has not infiltrated, forming a compressible elastic layer. As shown in Figure 5, when the grinding structure M1 is fixed to the base 4 through the adhesive layer 5, the lower portion 212 of the second infiltrated composite layer 21 will be compressed due to the pressure provided by the pressure plate P, while the upper portion 211 will maintain its initial thickness because it has already been filled with metal solder B. Since the lower portion 212 is compressed, its porosity is less than that of the upper portion 211.

[0051] Referring to Figure 6, which is a schematic diagram of another aspect of the trimmer D1 according to the first embodiment of the present invention. In other embodiments, a limiting baffle 42 may be provided around the mating surface 41 of the base 4. The limiting baffle 42 and the mating surface 41 together form a receiving cavity, and the grinding structure M1 can be disposed in the receiving cavity and fixed to the base 4 by the adhesive layer 5. This can not only avoid displacement during the surface bonding process, but also prevent glue overflow.

[0052] Because the grinding structure M1 of the present invention controls the degree and direction of warpage by configuring the second melt-infiltrated composite layer 21, when the pressure plate P applies pressure to flatten the grinding structure M1 and bond it to the base 4, the grinding surface 111 and grinding particles 12 of the grinding structure M1 are subjected to surface-enhanced compressive stress and are not prone to cracking. Even if the structure has original welding microcracks (for example, microcracks are generated on the welding surface of the first grinding particle 12), due to the enhanced compressive stress on the grinding surface 111 and the first grinding particle 12, the microcracks with residual compressive stress on the abrasive welding surface layer will only form closed cracks rather than open cracks, and there will be no crack expansion or further generation of new cracks.

[0053] [Second Embodiment]

[0054] Referring to Figures 7 and 8, Figure 7 is a schematic diagram of the grinding structure component of the second embodiment of the present invention, and Figure 8 is a schematic diagram of the dressing device of the second embodiment of the present invention. The grinding structure component M2 includes: a grinding structure layer 1, a support structure layer 2, and a welding layer 3. The welding layer 3 is disposed between the grinding structure layer 1 and the support structure layer 2. The grinding structure layer 1 includes a first melt-infiltrating composite layer 11 and a plurality of first grinding particles 12. The support structure layer 2 includes a second melt-infiltrating composite layer 21. The dressing device D2 includes the grinding structure component M2, a base 4, and an adhesive layer 5. The grinding structure component M2 (see Figure 8) is fixed to the base 4 by the adhesive layer 5.

[0055] The grinding structure M2 and dresser D2 of the second embodiment (Figures 7 and 8) have similar structures to those of the first embodiment (Figures 1 and 5), and the similarities will not be repeated. Compared with the first embodiment, the support structure layer 2 of the grinding structure M2 in the second embodiment further includes a plurality of second grinding particles 22. The plurality of second grinding particles 22 are dispersedly embedded on the lower surface of the second melt-infiltrated composite layer 21 (see Figure 7), and each second grinding particle 22 is partially exposed. In addition, for example, the second grinding particles 22 may include single-crystal diamond, polycrystalline diamond, polycrystalline diamond (PCD), CVD diamond, diamond, cubic boron nitride (cBN) particles, silicon carbide particles, or any combination thereof.

[0056] Specifically, when the first abrasive particles 12 are large (e.g., particle size greater than 0.5 mm) and numerous, the first infiltration composite layer 11 cannot be designed to be too thin (e.g., the thickness must be greater than 0.3 mm). Assuming the porosity of the first infiltration composite layer 11 after compression is 30%, a thicker metal solder B is required to allow the metal solder B to penetrate into the first infiltration composite layer 11 to achieve capillary saturation in order to effectively bond the abrasive particles. However, the larger first abrasive particles 12 dissipate heat quickly (the first abrasive particles 12 are made of diamond and have excellent thermal conductivity), which may cause the side of the first infiltration composite layer 11 with the first abrasive particles 12 to shrink faster and produce reverse warping. Therefore, the abrasive structure M2 of the present invention can further embed multiple second abrasive particles 22 on the lower surface of the second infiltration composite layer 21 to balance thermal stress. In addition, the total volume of the second abrasive particles 22 embedded in the second melt-infiltrated composite layer 21 can be greater than the total volume of the first abrasive particles 12 embedded in the first melt-infiltrated composite layer 11, thereby allowing the second melt-infiltrated composite layer 21 to dissipate heat faster and have a greater volume shrinkage.

[0057] [Third Embodiment]

[0058] Referring to Figures 9 and 10, Figure 9 is a schematic diagram of the grinding structure component according to the third embodiment of the present invention, and Figure 10 is a schematic diagram of the dressing device according to the third embodiment of the present invention. The grinding structure component M3 includes: a grinding structure layer 1, a support structure layer 2, and a welding layer 3. The welding layer 3 is disposed between the grinding structure layer 1 and the support structure layer 2. The grinding structure layer 1 includes a first infiltration composite layer 11 and a plurality of first grinding particles 12. The dressing device D3 includes the grinding structure component M3, a base 4, and an adhesive layer 5. The grinding structure component M3 is fixed to the base 4 by the adhesive layer 5.

[0059] The grinding structure M3 and dressing device D3 of the third embodiment (Figures 9 and 10) have similar structures to those of the first embodiment (Figures 1 and 5), and the similarities will not be described in detail. Compared with the first embodiment, the support structure layer 2 of the grinding structure M3 in the third embodiment includes a support plate 23 (different from the second melt-infiltrated composite layer 21 of the first embodiment), and the second bonding surface 20 is the surface of the support plate 23.

[0060] Specifically, when the first abrasive particles 12 are large (e.g., particle size greater than 0.5 mm) and numerous, the first infiltration composite layer 11 cannot be designed to be too thin (e.g., the thickness must be greater than 0.3 mm). Assuming the porosity of the first infiltration composite layer 11 after compression is 30%, a thicker metal solder B is required to allow the metal solder B to penetrate into the first infiltration composite layer 11 to achieve capillary saturation in order to effectively bond the abrasive particles. However, the first abrasive particles 12 dissipate heat quickly (the first abrasive particles 12 are made of diamond and have excellent thermal conductivity), which may cause the side of the first infiltration composite layer 11 with the first abrasive particles 12 to shrink faster and produce reverse warping. Therefore, the abrasive structure M3 of the present invention can further be provided with a support plate 23 on the other side of the welded layer 3 (i.e., the opposite side with the first infiltration composite layer 11). The support plate 23 can be a thin metal sheet, the material of which can be, for example, stainless steel (SUS316), and the thickness can be, for example, 0.1 mm. Because the support plate 23 has a large coefficient of thermal expansion and high rigidity, it has a large shrinkage rate when cooled. Therefore, the grinding structure M3 of the present invention can use the support plate 23 to control the overall warping degree.

[0061] [Beneficial Effects of the Examples]

[0062] The present invention provides grinding structural components M1-M3, dressing devices D1-D3, and a method for manufacturing the dressing devices. These components are assembled using a grinding structural layer 1, a support structural layer 2, and a welding layer 3. One side of the welding layer 3 is the grinding structural layer 1 with a low coefficient of thermal expansion, and the other side is the support structural layer 2 with a high coefficient of thermal expansion. This allows for control over the warpage of the welded grinding structural components M1-M3, ensuring it reaches the desired direction and amplitude.

[0063] Furthermore, to mitigate warping or wavy formation in the formed grinding structure, a supporting structural layer 2, namely the second fused composite layer 21, is incorporated into the grinding structure M1 of this invention. The second fused composite layer 21 increases the rigidity of the grinding structure M1, reducing the likelihood of wavy formation after cooling and solidification. Additionally, as shown in Figure 1, since the second fused composite layer 21 is also infiltrated by molten metal solder B (the second part B2), the amount of metal solder B forming the weld layer 3 is reduced, thus reducing the thickness of the weld layer 3. A thinner weld layer 3 results in less volume shrinkage during cooling and solidification (less tensile stress), thereby reducing warping and increasing the flexibility of the grinding structure.

[0064] The content disclosed above is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention specification and drawings are included in the scope of the patent application of the present invention.

[0065] D1, D2, D3: Trimmer M1, M2, M3: Grinding structural components 1: Grinding structure layer 11: First Melting Composite Layer 111: Grinding surface 112: First mating surface 113: First porous structure layer 12: First grinding particle 2: Supporting structural layer 20: Second mating surface 21: Second Melting Composite Layer 211: Upper part 212: Lower layer 213: Second porous structure layer 22: Second grinding particles 23: Support plate 3: Weld layer 4: Base 41: Joint surface 42: Limiting retaining wall 5: Adhesive layer B: Metal solder B1: Part One B2: Part Two V1: First pore V2: Second pore H1, H2, H3: Thickness S1, S2, S3: Steps

Claims

1. A grinding structure comprising: A polishing structure layer includes: a first melt-infiltrating composite layer having a polishing surface and a first bonding surface located on opposite sides; The structure comprises: a plurality of first abrasive particles, dispersedly embedded in the abrasive surface of the first infiltration composite layer, each of the first abrasive particles being partially exposed; a support structure layer having a second bonding surface facing the first bonding surface; and a welding layer disposed between the first bonding surface and the second bonding surface, for bonding the first infiltration composite layer and the support structure layer; wherein the first infiltration composite layer is formed by a portion of a metal solder infiltrating into the interior of a first porous structure layer, and the metal solder infiltrates through to the first bonding surface and bonds with the plurality of first abrasive particles; wherein the support structure layer includes a second infiltration composite layer, and the second bonding surface is the surface of the second infiltration composite layer, the second infiltration composite layer being formed by another portion of the metal solder infiltrating into the interior of a second porous structure layer, and the metal solder covering the second bonding surface of the second infiltration composite layer; wherein the metal solder does not penetrate into the first infiltration composite layer and the remaining portion of the second infiltration composite layer to form the welding layer.

2. The grinding structure as described in claim 1, wherein, The equivalent thermal expansion coefficient of the grinding structure layer is less than or equal to the equivalent thermal expansion coefficient of the supporting structure layer.

3. The grinding structure as described in claim 1, wherein, The average thickness of the second melt-infiltrated composite layer is greater than the average thickness of the first melt-infiltrated composite layer.

4. The grinding structure as described in claim 1, wherein, The supporting structure layer also includes a plurality of second abrasive particles, which are dispersedly embedded in the second melt-infiltrated composite layer, and each of the second abrasive particles is partially exposed.

5. A trimmer comprising: A base; And a grinding structure as described in claim 1, disposed on the base.

6. The trimmer as described in claim 5, wherein, In the grinding structure, the second infiltration composite layer includes an upper part and a lower part, wherein the upper part is the part infiltrated by the metal solder, and the lower part is the part not infiltrated by the metal solder.

7. The dressing device as claimed in claim 6 further includes an adhesive layer disposed between the base and the grinding structure, the adhesive layer being used to bond the base and the grinding structure, and a portion of the adhesive layer penetrating into the lower portion of the second melt-infiltrating composite layer.

8. The trimmer as described in claim 5, wherein, Each of the first abrasive particles has at least half of its volume embedded in the abrasive surface of the first melt-infiltrated composite layer.

9. The trimmer as described in claim 5, wherein, The thickness of the first infiltration composite layer is 0.05 mm to 0.5 mm, the thickness of the second infiltration composite layer is 0.1 mm to 1 mm, and the thickness of the welding layer is 0.005 mm to 0.1 mm.

10. The trimmer as claimed in claim 5, wherein, The porosity of the first melt-infiltrating composite layer is 10% to 50%, and the porosity of the second melt-infiltrating composite layer is approximately 20% to 95%.

11. A method for manufacturing a trimmer, comprising: first, A first porous structure layer is provided, and a plurality of first abrasive particles are embedded in a polishing surface of the first porous structure layer, with each first abrasive particle partially exposed on the polishing surface; then, a metal solder is disposed on a first bonding surface of the first porous structure layer, wherein the first bonding surface and the polishing surface are respectively located on opposite sides of the first porous structure layer; next, a support structure layer is provided, and a second bonding surface of the support structure layer contacts the metal solder, such that the metal solder is located between the first bonding surface and the second bonding surface; Finally, a hard soldering process is performed to melt the metal solder. The molten metal solder penetrates the first porous structure layer to form a first melt-penetration composite layer, and combines with multiple first abrasive particles and the support structure layer to form an abrasive structure. The first melt-penetration composite layer is formed by a portion of the metal solder melting into the interior of the first porous structure layer, and the metal solder melts through to the first bonding surface and combines with multiple first abrasive particles. The support structure layer includes a second melt-penetration composite layer, the second bonding surface being the surface of the second melt-penetration composite layer. The second melt-penetration composite layer is formed by the metal solder further melting into the interior of a second porous structure layer during the hard soldering process.

12. A method for manufacturing the trimmer as described in claim 11, wherein, The supporting structure layer also includes a plurality of second abrasive particles, which are dispersedly embedded in the second melt-infiltrated composite layer, and each of the second abrasive particles is partially exposed.

13. The method of manufacturing the trimmer as described in claim 11 further includes: A base and an adhesive are provided in advance, the adhesive being disposed on a mating surface of the base; Next, the grinding structure is disposed on the mating surface of the base, and the adhesive is located between the base and the grinding structure; Finally, a pressure plate is provided to press down the grinding structure, so that the grinding structure is bonded to the base through the adhesive.

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