Wire bundling apparatus and method for bundling wires

Abstract

A wire bundling apparatus is disclosed, comprising a fixed plate, wherein one surface is equipped with a transportation device, a cutting device, and a bundling device. The bundling device includes a platform, which is provided with a penetration area and a guiding section that are interconnected. A push rod is positioned below the platform for advancing the wires, while an extraction clamp is arranged above the platform and aligned with the guide rail for gripping the wires. Additionally, a nailing assembly is provided to secure the wires into bundles. This invention further provides a wire bundling method that effectively replaces the manual cutting and bundling of zongzi strings, thereby enhancing the efficiency of the zongzi wrapping process.

Description

Technical Field

[0001] This invention relates to a wire bundling device, and more particularly to a device for bundling multiple wires after bending them, and a method for bundling wires using the device. Prior Technology

[0002] In the traditional process of wrapping zongzi (sticky rice dumplings), the preparation of the string is a time-consuming and tedious step. Generally, to ensure that each zongzi is properly tied, a suitable length of string must first be prepared. This is usually done by hand cutting each piece of string to the same length from a large bundle, ensuring that each piece is sufficient for wrapping the zongzi. After cutting, the cut strings are neatly bundled together, usually in the quantity of zongzi to be steamed at one time, so that they can be cooked immediately after wrapping. Because each string needs to be cut and arranged manually, the preparation time is increased. Furthermore, because it is a manual operation, problems such as inconsistent lengths and tangled strings may occur, further affecting the smoothness of wrapping the zongzi. Summary of the Invention

[0003] In view of this, the present invention provides a wire bundling device that can replace manual bundling of zongzi wire, reducing the pre-processing time for making zongzi.

[0004] To achieve the above objectives, the present invention provides a wire bundling device, comprising a fixed plate, one surface of which is provided with a transport device, a cutting device, and a bundling device. The bundling device comprises: a platform, perpendicular to the surface of the fixed plate and spaced apart from it, the platform having a firing path having a guide section and a penetration area; a push rod, movably disposed on the fixed plate, the push rod moving linearly from the fixed plate downwards towards the platform; an extraction clamp, movably disposed on the fixed plate and located above the platform, the extraction clamp being aligned with the penetration area and reciprocating therein; and a nailing assembly adjacent to the extraction clamp and disposed on the platform.

[0005] The transport device includes two rollers arranged in parallel and spaced apart, which rotate toward each other.

[0006] The cutting device includes two blades and a fixing clamp. The two blades are arranged correspondingly to each other and rotate toward each other, while the fixing clamp is located above the two blades and aligned between them.

[0007] The nailing assembly includes a nail box, a firing device, and a baffle. The firing device and the baffle are respectively located in the guide section and the penetration area. The firing device moves linearly towards the baffle along the firing path, and the nail box is connected to the guide section.

[0008] The cutting device is located above the bundling device. The wire bundling equipment also includes a wire channel that is parallel to the fixing plate and extends from below the cutting device to the bundling device.

[0009] The fixing plate also includes at least one sensor located below the binding device.

[0010] The transport device also includes a positioning component.

[0011] The positioning component has two tubes arranged in parallel and fixed above the two rollers.

[0012] It also includes an extraction clamp located below the platform, which moves linearly toward the penetration area.

[0013] The present invention also provides a wire bundling method for a wire bundling device, the method comprising the following steps: S1: A transport device conveys a plurality of wires toward a cutting device and a bundling device until a sensor detects the ends of the wires; S2: A push rod moves to push the wires below the platform; S3: An extraction clamp moves and passes through a penetration area to grab the wires, at which point the push rod returns to its original position; S4: The cutting device cuts off the front ends of the wires; S5: The extraction clamp moves so that the wires pass through the penetration area and form a bend; S6: A firing device pushes a rivet toward the baffle along the penetration zone, bundling the wires together. Simple Explanation of the Diagram

[0014] Figure 1 is a schematic diagram of the wire bundling device of the present invention.

[0015] Figure 2 is a partially enlarged schematic diagram of the wire bundling device of the present invention.

[0016] Figures 3 and 4 are enlarged schematic diagrams of the bundling equipment of the present invention.

[0017] 5 shows a flowchart of the bundling method of the present invention.

[0018] 6 shows a schematic diagram of the finished product of the present invention. Implementation

[0019] In order to elaborate on the specific embodiments, constructions and achieved effects of the present invention, embodiments are provided and illustrated with diagrams. In this paper, the direction of movement (i.e., the X-axis) of the trigger 442 is the left-right direction, the direction of movement of the push rod 42 (i.e., the Y-axis) is the front-to-back direction, and the direction perpendicular to the platform 41 (i.e., the Z-axis) is the up-down direction.

[0020] See FIG In this embodiment, below the bundling device 40, the surface of the fixing plate is provided with at least one sensor 12, and when the wire 50 is transmitted downward, the at least one sensor 12 detects the tail end of the wire 50 and stops the transport device 20 to control the length of the wire 50 performing the operation.

[0021] Referring to FIG rotating and transmitting downwards, wherein, the transport device 20 is further provided with a position assembly for maintaining the wire material 50 on the Z-axis and smoothly entering between the two rollers 21 , the positioning assembly may be, but is not limited to, two tube bodies 22 disposed at intervals from each other.

[0022] The cutting device 30 includes two blades 31, which are arranged parallel to the X-axis. The wire 50 conveyed by the two rollers 21 continues to move downward between the two blades 31. When the two blades 31 rotate toward each other, they cut off the front end of the wire 50, causing the front end of the wire 50 to fall into the bundling device 40 below. In this embodiment, the two rollers 21 and the two blades 31 are driven by a sprocket and chain linkage, but this is not a limitation.

[0023] Next, please refer to Figures 3 and 4 for the bundling device 40 of the present invention. The bundling device 40 is provided with a platform 41 that is perpendicular to and spaced apart from the fixing plate 10. The upper surface of the platform 41 has a firing path arranged along the X-axis. The firing path includes a guide section 411 and a penetration area 412. The surface of the fixing plate 10 is provided with a push rod 42. The push rod 42 moves linearly along the Y-axis and below the platform 41. When the push rod 42 moves toward the platform 41, the wire 50 hanging from the push rod 42 is pushed to the platform 41. Below the guide section 411 and above the platform 41, there is an extraction clamp 43. The extraction clamp 43 is aligned with the penetration area 412 and moves along the Z-axis through the penetration area 412. If the extraction clamp 43 moves downward and passes through the penetration area 412, it will clamp the wire 50 that has been pushed below the penetration area 412. Then, after the extraction clamp 43 moves upward back to the top of the platform 41, the wire 50, together with the wire 50 after passing through the penetration area 412, will form a bend 51. At the same time, the extraction clamp 43 clamps the bend 51 and keeps it above the platform 41.

[0024] The binding device 40 also includes a nailing assembly 44, which includes a nail storage box 441, a firing device 442, and a baffle 443. The nail storage box 441 has an internal accommodating space for storing a plurality of rivets 52. The nail storage box 441 is located above the platform 41 adjacent to the extraction clip 43. The accommodating space is connected to the guide section 411, allowing the rivets 52 to enter the guide section 411 sequentially. In this embodiment, the rivets 52 are U-shaped with their openings facing the penetration area 412. The firing device 442 and the baffle 443 are separate. The rivet 52 is located between the free end of the guide section 411 and the penetration area 412. The rivet 52 located in the guide section 411 is positioned between the firing device 442 and the baffle 443. When the firing device 442 moves along the firing path toward the baffle 443, the rivet 52 in the guide section 411 is fired along the X-axis, bundling the wire 50 located in the penetration area 412 into a bundle. Then, the firing device 442 continues to move, pushing the rivet 52 and the wire 50 toward the baffle 443. The obstruction of the baffle 443 causes the pin of the rivet 52 to bend, thereby binding the wire 50.

[0025] In addition, the bundling device 40 is also provided with a pull-out clamp 45, which is located below the platform 41 and close to the free end of the penetration area 412. The pull-out clamp 45 moves along the X-axis toward the nailing assembly 44. Since the bent part 51 of the bundled wire 50 is against the upper part of the platform 41, after the pull-out clamp 43 releases the wire 50, the wire 50 will still remain on the platform 41. After the pull-out clamp 45 moves, it clamps the part of the wire 50 located below the platform 41, and then moves in the opposite direction to pull the wire 50, so that the bent part 51 can be smoothly removed from the penetration area 412.

[0026] In other embodiments, the wire bundling device also has a wire channel 11, which is parallel to the fixing plate 10 and extends from below the cutting device 30 to the bundling device 40, so that the wires 50 can move smoothly to the bundling device 40 and prevent external forces from interfering with the movement path. In addition, another channel (not shown) can be provided below the bundling device 40, the upper opening of which is aligned with the lower opening of the wire channel 11, so that the wires 50 can maintain movement along the Z-axis and avoid external forces causing inconsistent lengths of the cut wires 50.

[0027] Please refer to Figure 5, which is a flowchart of the wire bundling method of the above-mentioned wire bundling equipment. The steps of this method include: S1: The transport device 20 conveys a plurality of wires 50 toward the cutting device 30 and the bundling device 40 until the sensor 12 detects the tail ends of the wires 50; S2: The push rod 42 moves forward, pushing the wires 50 below the platform 41; S3: The extraction clamp 43 moves downward and passes through the penetration area 412 to clamp the wires 50, at which point the push rod 42 returns to its original position; S4: The cutting device 30 cuts off the front ends of the wires 50, and the front ends of the wires 50 fall below the platform 41; S5: The extraction clamp 43 moves upward so that the wires 50 pass through the penetration area 412 and form a bend 51; S6: The firing device 442 pushes the rivet 52 toward the baffle 443 along the penetration area 412, bundles the wires 50 together, and then the extraction clamp 43 releases the wires 50, with the bend 51 abutting against the top of the platform 41; S7: The extraction clamp 45 moves to the left and clamps the wires, then moves to the right and pulls the wires 50 so that the bend 51 passes through the penetration area 412.

[0028] Accordingly, the wire bundling device and method of the present invention cuts the original large bundle of wire into equal lengths and bundles them into a fixed quantity, as shown in Figure 6. Each bundle of wire 50 has the bent part 51 and is fixed by the rivet 52. When wrapping zongzi, the bent part 51 is put on the hook or fixed in one place with the clip, and the wrapped zongzi is tied and fixed by the end 53 of the hanging wire 50. Finally, the whole bundle of zongzi is cooked. During the process, whether it is the preparation before wrapping zongzi or before cooking, the user does not need to spend time tidying up the wire 50, which effectively improves the efficiency of making zongzi.

[0029] The descriptions of the embodiments and specific examples of the present invention are not the only forms of implementing or applying the specific examples of the present invention. Other specific examples can be used to achieve the same or equivalent functions and steps.

[0030] 10: Fixing plate 11: Cable Channel 12: Sensor 20: Transport equipment 21: Roller 22:Tube body 30: Cutting device 31: Knives 32: Fixing clip 40: Bundling device 41: Platform 411: Guiding Section 412: Penetration Zone 42: Putter 43: Extraction Clip 44: Nail assembly 441: Nail Box 442: Firing device 443: Baffle 45: Extraction Clip 50: Wire 51: Bending section 52: Rivet 53:End S1-S7: Steps

Claims

1. A wire bundling device comprising a fixed plate, one surface of which is provided with a transport device, a cutting device, and a bundling device, characterized in that: the bundling device comprises: a platform, perpendicular to the surface of the fixed plate and spaced apart from the fixed plate, the platform having a firing path having a guide section and a penetration area; a push rod, movably disposed on the fixed plate, the push rod moving linearly from the fixed plate toward the lower part of the platform; an extraction clamp, movably disposed on the fixed plate and located above the platform, the extraction clamp being aligned with the penetration area and reciprocating therethrough; and a nailing assembly adjacent to the extraction clamp and disposed on the platform.

2. The wire bundling device as claimed in claim 1, wherein the transport device includes two rollers arranged in parallel and spaced apart, the two rollers rotating toward each other.

3. The wire bundling device as claimed in claim 1, wherein the cutting device includes two blades and a fixing clamp, the two blades being disposed corresponding to each other and rotating toward each other, and the fixing clamp being disposed above the two blades and aligned between the two blades.

4. The wire bundling device as claimed in claim 1, wherein the nailing assembly includes a nail box, a firing device and a baffle, the firing device and the baffle are respectively disposed in the guide section and the penetration area, the firing device moves linearly towards the baffle along the firing path, and the nail box is connected to the guide section.

5. The wire bundling device as claimed in claim 1, wherein the cutting device is located above the bundling device, and the wire bundling device further includes a wire channel parallel to the fixing plate and extending from below the cutting device to the bundling device.

6. As described in claim 5, wherein the fixing plate further includes at least one sensor located below the binding device.

7. The wire bundling device as described in claim 2, wherein the transport device further includes a positioning component.

8. The wire bundling device as claimed in claim 7, wherein the positioning component has two tubes arranged in parallel and fixed above the two rollers.

9. The wire bundling device as described in any one of claims 1 to 8, further comprising a pull-out clamp located below the platform and linearly moving toward the penetration area.

10. A method of bundling wires using the wire bundling device as described in any one of claims 1 to 9, the method comprising the following steps: S1: a transport device conveys a plurality of wires toward a cutting device and a bundling device until a sensor detects the tail ends of the wires; S2: a push rod moves to push the wires below a platform; S3: an extraction clamp moves and passes through a penetration zone to clamp the wires, at which point the push rod returns to its original position; S4: the cutting device cuts off the front ends of the wires; S5: the extraction clamp moves to form a bend in the wires after passing through the penetration zone; S6: a trigger pushes a rivet along the penetration zone toward a stop, bundling the wires into a bundle.

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