Low molecular weight reduction device and method for manufacturing low molecular weight resin

TW202637349APending Publication Date: 2026-09-16SHIBAURA MASCH CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW115109069
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-13
Filing Date
2026-03-11
Publication Date
2026-09-16

Smart Images

  • Figure TWG2TA001077350_001
    Figure TWG2TA001077350_001
  • Figure TWG2TA001077350_002
    Figure TWG2TA001077350_002
  • Figure TWG2TA001077350_003
    Figure TWG2TA001077350_003
Patent Text Reader

Abstract

This invention provides a low molecular weight resin production apparatus that can produce low molecular weight resin with a target viscosity even when using various grades of resin, such as general-purpose resin and recycled resin, as raw material resins, by inputting a target viscosity value. The low molecular weight resin production apparatus 1 includes: a high-shear processing unit 3, which applies shear force by rotating a screw to reduce the molecular weight of the raw material resin; a cooling unit 4, which cools the low molecular weight resin produced by the high-shear processing unit 3 at a predetermined temperature; a detection unit 5, which detects the pressure loss of the low molecular weight resin after cooling by the cooling unit 4; and a control unit 6, which provides feedback control of the processing conditions in the high-shear processing unit 3 based on the pressure loss.
Need to check novelty before this filing date? Find Prior Art