Resin molding apparatus and method for manufacturing resin molded articles

Abstract

This invention provides a resin supply device to prevent a release film disposed within a mold cavity from stretching and breaking. The resin molding apparatus includes a lower mold, an upper mold, and a mold closing mechanism for closing the lower and upper molds. One of the lower and upper molds has a mold cavity for receiving a workpiece to be resin molded, and includes a first block forming a side surface of the mold cavity and a second block forming a bottom surface of the mold cavity. The resin molding apparatus further includes a vertical movement mechanism for moving the first block relative to the second block in a vertical direction. The first block has a through hole extending horizontally, the through hole communicating with the bottom surface of the mold cavity and for the release film to pass through. By moving the first block using the vertical movement mechanism, the second block is disposed within the through hole, and the release film disposed within the through hole is disposed on the bottom surface of the mold cavity.

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