Transfer laminate

TW202637373APending Publication Date: 2026-09-16OIKE & CO LTD
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Patent Information

Application Number
TW114145061
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-11
Filing Date
2025-11-19
Publication Date
2026-09-16

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    Figure TWG2TA001076453_003
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Abstract

[Problem] A transfer printed laminate used for forming a circuit board and showing minimal change in stripping property before and after heat loading, and good stripping property after heat loading is provided. [Solution] A transfer printed laminate sequentially comprises a substrate, a conductive layer, a stripping layer, and a conductive auxiliary layer. The conductive layer comprises copper; the stripping layer comprises an alloy of nickel and chromium; and the conductive auxiliary layer comprises copper.
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