Method for operating semiconductor processing system

TW202637453APending Publication Date: 2026-09-16TSMC CHINA COMPANY +1
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Patent Information

Application Number
TW114120145
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-12
Filing Date
2025-05-28
Publication Date
2026-09-16

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Abstract

A method for operating a semiconductor processing system is provided. The method includes performing a semiconductor process by a semiconductor fabrication apparatus, wherein the semiconductor fabrication apparatus comprises a plurality of load ports arranged substantially along a first direction in a top view; moving a stage between a first region and a second region substantially along a second direction intersecting the first direction in the top view, wherein the stage supports a transfer robot, and the first region is nearer to the load ports than the second region is; using the transfer robot, transferring a wafer carrier between a stocker apparatus and a semiconductor fabrication apparatus when the stage is at the first region; and performing a maintenance process to the semiconductor fabrication apparatus when the stage is at the second region.
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