Method for cooling heat-generating device, cooling device and method for making carrier wafer

TW202637458APending Publication Date: 2026-09-16TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information

Application Number
TW114116667
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-07
Filing Date
2025-05-02
Publication Date
2026-09-16

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Abstract

Micro-electromechanical systems (MEMS) devices that include a carrier wafer are disclosed, along with their use for cooling heat-generating devices using dielectric liquids. The MEMS device includes an actuator bonded to a carrier wafer. The carrier wafer includes a plurality of holes extending through a substrate. The carrier wafer is adhered to a surface of the heat-generating device, and the resulting package is placed in the dielectric liquid. The actuator vibrates and increases the rate of liquid flow past the heat-generating device, improving the cooling effect.
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