Micro perforation processing method for glass substrate

Abstract

A micro perforation processing method for glass substrate includes a mold and a glass substrate providing step, a heating step, a heat compressing step, a cooling step, a demolding step, and a forming perforation step. After heating the mold and the glass substrate, when the glass substrate is heated to the glass transition temperature, a forming portion of the mold forms a recess on the glass substrate first. After the mold and the glass substrate are cooled and demolded, a perforation is formed in each recess, thereby shortening the time required to form the perforation.

Description

[Technical Field]

[0001] This application relates to glass processing methods, and in particular to a method for processing micro-perforations in a glass substrate. [Previous Technology]

[0002] As chips become thinner, smaller, lower power, lower cost, and more multifunctional, the space for placing chips in devices using chips is getting smaller and smaller. Therefore, a through glass via (TGV) technology has been developed. By creating vertically penetrating micro-perforations on a glass substrate and filling the perforations with conductive material, electrical connections between chips in the vertical direction can be achieved, thereby reducing the space required for chip placement.

[0003] However, most current methods for forming micro-perforations on glass substrates involve processing the glass substrate at room temperature to form micro-perforations with a high aspect ratio. Currently, the methods for forming micro-perforations with a high aspect ratio are mostly laser drilling, ultrasonic drilling, micro electrical discharge machining (μ-EDM), micro powder blasting, or inductively coupled plasma reactive ion etching (ICP-RIE). When forming micro-perforations using the aforementioned methods, problems such as long processing time, poor accuracy, high manufacturing difficulty, and low manufacturing efficiency are often encountered, and therefore need to be improved. [Summary of the Invention]

[0004] This application provides a method for micro-perforation processing of a glass substrate, including a step of providing a mold and a glass substrate, a heating step, a hot pressing step, a cooling step, a demolding step, and a perforation forming step. The step of providing a mold and a glass substrate involves providing a mold and a glass substrate. The mold includes a base and a plurality of forming parts. The glass substrate includes opposing first and second surfaces, which are perpendicularly connected to define a first direction. The first surface of the glass substrate faces the mold. The heating step involves heating the mold and the glass substrate. The hot pressing step involves bringing the mold and the glass substrate closer together while the glass substrate is heated to its glass transition temperature, and the forming parts of the mold penetrate the first surface of the glass substrate to form a plurality of recesses. The cooling step involves cooling the mold and the glass substrate. The demolding step involves separating the mold from the glass substrate when the glass substrate cools to room temperature. The perforation forming step involves thinning the thickness of the glass substrate from the second surface in the first direction to each recess, and hollowing out each recess from the second surface to form a plurality of perforations.

[0005] In some embodiments, the first and second surfaces of the aforementioned glass substrate have a first depth in a first direction, the recess has a second depth in a first direction, and the perforation has a third depth in a first direction, wherein the second depth is greater than the third depth.

[0006] This application provides another method for micro-perforation processing of a glass substrate, including a step of providing a mold and a glass substrate, a heating step, a hot pressing step, a cooling step, a demolding step, a perforation forming step, and a thinning step. The step of providing a mold and a glass substrate involves providing a mold and a glass substrate. The mold includes a base and a plurality of forming parts. The glass substrate has a glass transition temperature and includes opposing first and second surfaces. The first and second surfaces are perpendicularly connected to define a first direction, and the first surface of the glass substrate faces the mold. The heating step involves heating the mold and the glass substrate. The hot pressing step involves bringing the mold and the glass substrate closer together while the glass substrate is heated to its glass transition temperature, and the forming parts of the mold penetrate the first surface of the glass substrate to form a plurality of recesses. The cooling step involves cooling the mold and the glass substrate. The demolding step involves separating the mold from the glass substrate when the glass substrate cools to room temperature. The perforation forming step involves penetrating each recess along the first direction, so that each recess connects to the second surface to open and form a plurality of perforations. The thinning step involves thinning the thickness of the glass substrate in the first direction from the second surface of the glass substrate.

[0007] In some embodiments, the first surface and the second surface of the aforementioned glass substrate have a first depth in a first direction, the recess has a second depth in a first direction, the first depth is greater than the second depth, and in the perforation forming step, the perforation has a third depth in a first direction, the first depth is greater than the second depth.

[0008] In some embodiments, after the aforementioned thinning step, the second depth is greater than the third depth.

[0009] This application further provides a method for micro-perforation processing of a glass substrate, including a step of providing a mold and a glass substrate, a heating step, a hot pressing step, a cooling step, a demolding step, and a perforation forming step. The step of providing a mold and a glass substrate involves providing two molds and a glass substrate. Each mold includes a base and a plurality of forming parts. The glass substrate has a glass transition temperature and includes opposing first and second surfaces. The first and second surfaces are perpendicularly connected to define a first direction. The first and second surfaces of the glass substrate face each mold. The heating step involves heating each mold and the glass substrate. The hot pressing step involves bringing each mold and the glass substrate closer together while the glass substrate is heated to its glass transition temperature. The forming part of the mold facing the first surface penetrates through the first surface to form a plurality of first recesses, and the forming part of the mold facing the second surface penetrates through the second surface to form a plurality of second recesses. The cooling step involves cooling the molds and the glass substrate. The demolding step involves separating the molds from the glass substrate when the glass substrate cools to room temperature. The perforation forming step involves penetrating each first recess and each second recess through the first direction to form a plurality of perforations.

[0010] In some embodiments, the aforementioned perforation formation step is accomplished by chemical mechanical polishing.

[0011] In some embodiments, the aforementioned perforation formation step is performed by mechanical grinding.

[0012] In some embodiments, the aforementioned forming part is a cylinder.

[0013] In some embodiments, the aforementioned forming part is a cone.

[0014] In some embodiments, the aforementioned mold is made of titanium alloy.

[0015] In some embodiments, the aforementioned perforation forming step is performed by etching to form the perforations.

[0016] In some embodiments, the aforementioned thinning step is accomplished by chemical mechanical polishing.

[0017] In some embodiments, the aforementioned thinning step is accomplished by mechanical grinding.

[0018] In some embodiments, the aforementioned perforation forming step is performed by laser processing to form the perforations.

Implementation Method

[0019] Before this application is described in detail in various embodiments, please note that in the following description, the drawings of this application are only for illustration and are not necessarily drawn to scale, and not all details are necessarily presented in the drawings.

[0020] The orientation or similar terms used in this application, such as "front", "back", "left", "right", "top", "bottom", "inner", "outer", and "side", indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the purpose of assisting in explanation and understanding, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and are not intended to limit this application.

[0021] The use of the quantifiers "a" or "an" for the elements and components described in this application is merely for convenience and to provide the general meaning of the scope of the invention; in this application, it should be interpreted as including one or at least one, and a single concept also includes plural cases, unless it clearly indicates otherwise. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "plural" means two or more.

[0022] The terms “combination”, “integration” or “assembly” used in this application mainly include the type of connection that allows the components to be separated without damaging them, or the connection that makes the components inseparable. These are terms that those with ordinary knowledge in the art can choose based on the material of the components to be connected or the assembly requirements.

[0023] This application provides a method for processing micro-perforations on a glass substrate, which can form micro-perforations H with a high aspect ratio (HAR) on a glass substrate. Here, the micro-perforation H refers to a perforation H that penetrates through the glass substrate 20. In some embodiments, the diameter of the perforation H is between 10 μm and 100 μm, and the aspect ratio is between 5 and 20. In some embodiments, this application mainly involves a pre-processing heat treatment before forming the perforation H, thereby reducing processing difficulty, increasing processing speed, and maintaining processing quality.

[0024] Referring to Figures 1 and 2, Figure 1 is a flowchart of one embodiment of the micro-perforation processing method for glass substrates according to this application; Figure 2 is a schematic diagram of one embodiment of the micro-perforation processing method for glass substrates according to this application. In some embodiments, the micro-perforation processing method for glass substrates includes a step S1 of providing a mold and a glass substrate, a heating step S2, a hot pressing step S3, a cooling step S4, a demolding step S5, and a perforation forming step S6. In these embodiments, a portion of the perforation H (i.e., the recess R) is formed first after the hot pressing step S3, and the remaining portion of the perforation H is formed after the cooling step S4 and the demolding step S5, thereby reducing the processing distance required for the perforation forming step S6 and improving processing efficiency.

[0025] Referring to Figures 1 and 2, step S1 of providing the mold and glass substrate involves providing a mold 10 including a base 11 and a plurality of forming parts 12, and a glass substrate 20 including opposing first surfaces 21 and second surfaces 22. The first surfaces 21 and second surfaces 22 of the glass substrate 20 are vertically connected, defining a first direction D1, and the first surface 21 of the glass substrate 20 faces the forming parts 12 of the mold 10.

[0026] Referring to Figures 1 to 3, Figure 3 is a schematic diagram of an embodiment of the micro-perforation processing method for glass substrates according to this application. In some embodiments, the forming portion 12 is a protruding pillar structure protruding from the base 11, which can form a correspondingly shaped recess R on the glass substrate 20. Therefore, the shape of the forming portion 12 depends on the shape of the required perforation H. As shown in some embodiments of Figures 2 and 3, the base 11 is a flat plate structure, and the forming portion 12 is a cylinder protruding from one surface of the base 11. In these embodiments, the forming portion 12 has a first end 121 and a second end 122 opposite to each other. The first end 121 is connected to the base 11, and the second end 122 is away from the base 11. Here, the diameter of the first end 121 is the same as the diameter of the second end 122.

[0027] Referring to Figures 1 to 3, in some embodiments, the glass substrate 20 is a flat plate structure. In these embodiments, the glass substrate 20 is arranged with its first surface 21 and second surface 22 parallel to the horizontal plane, and the mold 10 is disposed above the glass substrate 20. In some embodiments, the mold 10 and the glass substrate 20 can be detachably disposed on the drive machine 30. The drive machine 30 is provided with a connector or fixture to connect the mold 10 or the glass substrate 20, thereby allowing the drive machine 30 to drive the mold 10 and the glass substrate 20 to perform the subsequent hot pressing step S3.

[0028] Referring to Figures 1 to 3, heating step S2 heats both the mold 10 and the glass substrate 20. In some embodiments, heating step S2 heats both the mold 10 and the glass substrate 20 simultaneously. In some embodiments, the drive unit 30 includes a first fixture 31 and a second fixture 32, with the mold 10 disposed on the first fixture 31 and the glass substrate 20 disposed on the second fixture 32. In some embodiments, the first fixture 31 has a first heating element 311, the second fixture 32 has a second heating element 321, and the drive unit 30 has a controller 33 and a temperature sensing module 34. The controller 33 is electrically connected to the first heating element 311 and the second heating element 321, and the temperature sensing module 34 is disposed on the second fixture 32. In this way, the controller 33 of the drive unit 30 can control the first heating element 311 and the second heating element 321 to heat the mold 10 and the glass substrate 20 through the first fixture 31 and the second fixture 32, respectively. The temperature sensing module 34 can sense the temperature of the glass substrate 20, thereby providing the controller 33 with the control to determine whether to complete the heating step S2 in order to perform the hot pressing step S3 based on the sensing of the temperature sensing module 34.

[0029] Referring to Figures 1 to 3, the hot pressing step S3 is performed when the glass substrate 20 is heated to the glass transition temperature (Tg), the mold 10 and the glass substrate 20 are relatively close, and the forming part 12 of the mold 10 penetrates the first surface 21 of the glass substrate 20 to form a plurality of recesses R.

[0030] Glass transition, also known as glass transformation, is short for glass-liquid transition. It refers to the gradual and reversible transformation of amorphous materials or semi-crystalline materials in amorphous regions from a hard, brittle, and transparent glassy state to a viscous or rubbery state as the temperature increases; that is, the "glass-elastic transition". The glass transition temperature is the temperature at which a glassy substance can reversibly transform between the glassy and elastic states. When the temperature of a substance is below the glass transition temperature, the molecular chains cannot move, and the substance is in a rigid "glassy state". When the temperature of a substance is above the glass transition temperature, the amorphous molecular chains begin to move locally, and the substance exhibits soft and flexible properties similar to rubber. Therefore, when the glass substrate 20 is heated to the glass transition temperature, the state of the glass substrate 20 will change from hard and brittle to elastic, and the forming part 12 of the mold 10 can penetrate into the glass substrate 20 and form a recess R on the first surface 21 of the glass substrate 20 through the protruding forming part 12 on the mold 10.

[0031] Referring to Figures 1 to 3, in some embodiments, since the glass substrate 20 becomes movable after being heated to the glass transition temperature, in order to avoid unexpected displacement of the glass substrate 20 during the hot pressing step S3, which would affect the shape and position of the recess R, in these embodiments, the drive unit 30 drives the connecting mold 10, and the glass substrate 20 is fixed to the drive unit 30. Therefore, during the hot pressing step S3, the drive unit 30 drives the mold 10 to move along the first direction D1 closer to the glass substrate 20, while the glass substrate 20 remains fixed. This avoids unexpected flow or displacement of the glass substrate 20 during the hot pressing step S3, ensuring the shape and position of the formed recess R.

[0032] Referring to Figures 1 to 3, cooling step S4 involves cooling the mold 10 and the glass substrate 20. In some embodiments, cooling step S4 is performed after hot pressing step S3, that is, after the mold 10 forms the recess R on the glass substrate 20, the mold 10 and the glass substrate 20 are cooled. In these embodiments, the mold 10 and the glass substrate 20 are cooled simultaneously after hot pressing step S3 is completed, that is, the mold 10 is cooled while the forming part 12 is inserted into the recess R.

[0033] In some embodiments, in the cooling step S4, the mold 10 and the glass substrate 20 are naturally cooled at room temperature. The cooling time depends on the size of the mold 10 and the glass substrate 20. The cooling step S4 cools the mold 10 and the glass substrate 20 to room temperature.

[0034] In some embodiments, the coefficient of thermal expansion of the mold 10 is greater than that of the glass substrate 20. Based on the physical property of thermal expansion and contraction of materials, after the cooling step S4, the mold 10 and the glass substrate 20 shrink, and the shrinkage rate and volume of the mold 10 are greater than those of the glass substrate 20. As a result, after the cooling step S4, the forming part 12 of the mold 10 can naturally separate slightly from the recess R, which facilitates demolding. In some embodiments, the mold 10 is made of a titanium alloy with high temperature resistance and corrosion resistance.

[0035] Referring to Figures 1 to 3, demolding step S5 occurs when the glass substrate 20 cools to room temperature, at which point the mold 10 separates from the glass substrate 20. Thus, after cooling step S4, the mold 10 and glass substrate 20 move away from each other, completing demolding. In some embodiments where the mold 10 and glass substrate 20 are arranged on the drive platform 30, the drive platform 30 drives the mold 10 away from the glass substrate 20 along a first direction D1, while the glass substrate 20 is located at a fixed position on the drive platform 30; however, this invention is not limited to this. In other embodiments, the drive platform 30 drives both the mold 10 and the glass substrate 20. Through the control of the controller 33, it can be controlled that during the hot pressing step S3, the drive platform 30 only moves the mold 10, while during the demolding step S5, since the glass substrate 20 has cooled and solidified, the drive platform 30 can simultaneously move the mold 10 and the glass substrate 20 in opposite directions, thereby improving the demolding speed and efficiency.

[0036] Referring to Figures 1 and 4, Figure 4 is a schematic diagram of an embodiment of the micro-perforation processing method for glass substrates according to this application. In some embodiments, to facilitate the demolding of the mold 10 and the glass substrate 20 in the demolding step S5, the cross-sectional area of ​​the second end 122 of the forming portion 12 of the mold 10 is smaller than the cross-sectional area of ​​the first end 121. In some embodiments, the forming portion 12 is a cone. Specifically, the cross-section of the junction between the first end 121 and the base 11 of the forming portion 12 is circular, the cross-section of the second end 122 of the forming portion 12 is circular, the cross-section of the junction between the first end 121 and the base 11 of the forming portion 12 and the cross-section of the second end 122 are concentric, and the diameter of the cross-section of the junction between the first end 121 and the base 11 of the forming portion 12 is larger than the diameter of the cross-section of the second end 122 of the forming portion 12. This reduces the difficulty of separating the mold 10 from the glass substrate 20 and improves the efficiency of the demolding step S5.

[0037] Referring to Figures 1 to 4, the perforation step S6 involves penetrating each recess R, causing each recess R to be hollowed out from the second surface 22 to form a plurality of perforations H. In some embodiments, each recess R formed after the demolding step S5 has an opening R01 and a bottom R02. The opening R01 is open on the first surface 21 of the glass substrate 20, and the bottom R02 is parallel to the second surface 22 and is not located between the first surface 21 and the second surface 22.

[0038] Referring to FIG2, in some embodiments, the first surface 21 and the second surface 22 of the glass substrate 20 have a first depth Z1 in the first direction D1, the recess R has a second depth Z2 in the first direction D1, and the through hole H has a third depth Z3 in the first direction D1. The second depth Z2 is 70% to 95% of the first depth Z1, and the second depth Z2 is greater than the third depth Z3.

[0039] As described above, this application first forms most of the through hole H (i.e., the recess R) through the heat treatment of the glass substrate 20, and then forms the through hole H by penetrating the recess R. In this way, most of the through hole H is completed by the heat treatment of the glass substrate 20 in conjunction with the mold 10. In this way, the through hole forming step S6 can be applied to various methods of forming through holes H and can maintain high processing efficiency. The details of completing the through hole forming step S6 according to different methods are described below.

[0040] Referring to Figures 1, 2 and 4, in some embodiments, the perforation forming step S6 can be accomplished by a thinning process to simultaneously reduce the thickness of the glass substrate 20 and form the perforation H. In these embodiments, the perforation forming step S6 can be accomplished by physical thinning or chemical mechanical polishing thinning.

[0041] Referring to Figures 1, 2, and 4, in some embodiments where the perforation step S6 is completed through physical thinning, after the demolding step S5, the perforation step S6 involves thinning the thickness of the glass substrate 20 in the first direction D1 from the second surface 22 of the glass substrate 20 to each recess R. Each recess R is hollowed out from the second surface 22 of the glass substrate 20 to become a perforation H. In some embodiments, the physical thinning method is mechanical grinding. That is, after the demolding step S5 is completed, mechanical grinding is performed on the second surface 22 of the glass substrate 20 to thin the thickness of the glass substrate 20 in the first direction D1 until the desired total thickness variation (TTV) is achieved. When the mechanical grinding reaches the position of the recess R, the recess R is penetrated and can be hollowed out from the second surface 22 to become a perforation H.

[0042] In some embodiments, the perforation forming step S6 is performed by chemical-mechanical polishing (or chemical-mechanical planarization). In these embodiments, after the demolding step S5, the perforation forming step S6 involves thinning the thickness of the glass substrate 20 in the first direction D1 from the second surface 22 of the glass substrate 20 to each recess R, and each recess R is hollowed out from the second surface 22 of the glass substrate 20 to become each perforation H. Here, after the demolding step S5 is completed, the perforation forming step S6 forms the perforations H by chemical-mechanical polishing. Chemical-mechanical polishing is to reduce the thickness of the second surface 22 of the glass substrate 20 in the first direction D1 through chemical etching and mechanical force until the required total thickness change is achieved, and perforations H are formed simultaneously. When the chemical-mechanical polishing reaches the position of the recess R, the recess R is penetrated and can be hollowed out from the second surface 22 to become a perforation H.

[0043] Referring to Figures 1, 5, and 6, Figure 5 is a flowchart of another embodiment of the micro-perforation processing method for glass substrates according to this application; Figure 6 is a schematic diagram of another embodiment of the micro-perforation processing method for glass substrates according to this application. In some embodiments, the micro-perforation processing method for glass substrates sequentially completes the perforation forming step S6 and the thinning step S7 after the demolding step S5. In these embodiments, the perforation forming step S6 is mainly to form perforations H at each recess R position without thinning the thickness of the glass substrate 20 in the first direction D1. That is, in this embodiment, the first depth Z1 is greater than the second depth Z2, and the third depth Z3 is equal to the first depth Z1.

[0044] After the perforation step S6, a thinning step S7 is performed to reduce the thickness of the glass substrate 20 in the first direction D1 to the desired total thickness change. Here, the thinning step S7 thins the glass substrate 20 from the second surface 22. Since the perforation H has already been formed by the perforation step S6, during the thinning step S7, it is not necessary to thin to the position of the recess R formed in the demolding step S5. Only the desired overall thickness of the glass substrate 20 in the first direction D1 and the total thickness change TTV need to be considered. That is, in this embodiment, after the thinning step S7, the third depth Z3 can be greater than the second depth Z2, or the third depth Z3 can be less than the second depth Z2.

[0045] Referring to Figures 1, 5 and 6, in some embodiments of the glass substrate micro-perforation processing method including the perforation forming step S6 and the thinning step S7, the perforation forming step S6 may be formed by, but is not limited to, laser drilling, ultrasonic drilling, micro electrical discharge machining (μ-EDM), micro powder blasting, or inductively coupled plasma reactive ion etching (ICP-RIE). In these embodiments, the medium (laser beam, ultrasound, electrode, or etching medium) used to form a through hole H by penetrating the recess R is applied to each recess R by the first surface 21 of the glass substrate 20 along the first direction D1 through the opening R01 of each recess R to contact the bottom R02 of each recess R. In this way, the medium used to form a through hole H by penetrating the recess R can penetrate the bottom R02 of each recess R along the first direction D1, so that each recess R is connected to the second surface 22 and becomes a through hole H.

[0046] In some embodiments of the glass substrate micro-perforation processing method that include a perforation forming step S6 and a thinning step S7, the thinning step S7 can be completed by physical thinning or chemical mechanical polishing as described in the aforementioned embodiments. Therefore, since the perforation forming step S6 is completed after the demolding step S5, it can be ensured that the glass substrate 20 forms a perforation H after the thinning step S7, and that the perforation H is not failed to be formed due to insufficient thickness reduction in the thinning step S7.

[0047] Referring to FIG7, FIG7 is a schematic diagram of another embodiment of the micro-perforation processing method for glass substrates of this application. In some embodiments, the micro-perforation processing method for glass substrates forms perforations H through molds 10. In these embodiments, in step S1 of providing molds and glass substrates, two molds 10 and a glass substrate 20 are provided. Each mold 10 includes a base 11 and a plurality of forming portions 12. The first surface 21 and the second surface 22 of the glass substrate 20 face each mold 10. That is, the two molds 10 are located on both sides of the glass substrate 20.

[0048] In these embodiments, during the hot pressing step S3, each mold 10 and glass substrate 20 are hot pressed close to each other to generate a plurality of recesses R. Here, the recesses R include first recesses R1 and second recesses R2. The forming part 12 of the mold 10 facing the first surface 21 passes through the first surface 21 to form a plurality of first recesses R1, and the forming part 12 of the mold 10 facing the second surface 22 passes through the second surface 22 to form a plurality of second recesses R2.

[0049] Thus, in the perforation step S6, a plurality of perforations H are formed by penetrating each first recess R1 and each second recess R2 of the glass substrate 20 from the first direction D1. In these embodiments, the perforation step S6 may be formed by, but is not limited to, drilling, laser drilling, ultrasonic drilling, micro electrical discharge machining (μ-EDM), micro powder blasting, or inductively coupled plasma reactive ion etching (ICP-RIE). In this way, the first recess R1 and the second recess R2 formed by the two molds 10 can cover most of the area of ​​the required perforation H. That is, the distance between the first recess R1 and the second recess R2 in the first direction D1 can be shortened as much as possible. Then the thickness required to penetrate when forming the perforation step S6 can be reduced as much as possible, shortening the time required to form the perforation step S6 and improving the efficiency of forming the perforation H. [Simplified Explanation of the Diagram]

[0050] Figure 1 is a flowchart illustrating the steps of one embodiment of the micro-perforation method for glass substrates according to this application. Figure 2 is a schematic diagram illustrating one embodiment of the micro-perforation method for glass substrates according to this application. Figure 3 is a schematic diagram illustrating another embodiment of the micro-perforation method for glass substrates according to this application. Figure 4 is a schematic diagram illustrating a third embodiment of the micro-perforation method for glass substrates according to this application. Figure 5 is a flowchart illustrating the steps of another embodiment of the micro-perforation method for glass substrates according to this application. Figure 6 is a schematic diagram illustrating another embodiment of the micro-perforation method for glass substrates according to this application. Figure 7 is a schematic diagram illustrating yet another embodiment of the micro-perforation method for glass substrates according to this application.

Claims

1. A method for fabricating micro-perforations on a glass substrate, comprising: The process includes a step of providing a mold and a glass substrate, wherein the mold includes a base and a plurality of forming portions, the glass substrate has a glass transition temperature, the glass substrate includes a first surface and a second surface opposite to each other, the first surface and the second surface being perpendicularly connected to define a first direction, and the first surface of the glass substrate facing the mold; a heating step of heating the mold and the glass substrate; a hot pressing step of bringing the mold and the glass substrate closer together along the first direction while the glass substrate is heated to the glass transition temperature, wherein the forming portions of the mold penetrate the first surface of the glass substrate to form a plurality of recesses; a cooling step of cooling the mold and the glass substrate; a demolding step of separating the mold from the glass substrate when the glass substrate is cooled to room temperature; and a perforation step of thinning the thickness of the glass substrate in the first direction from the second surface to each of the recesses, wherein each of the recesses is hollowed out from the second surface to form a plurality of perforations.

2. The method for forming micro-perforations on a glass substrate as described in claim 1, wherein the perforation formation step is performed by chemical mechanical polishing.

3. The method for forming micro-perforations on a glass substrate as described in claim 1, wherein the perforation formation step is completed by mechanical grinding.

4. The method for micro-perforation of a glass substrate as described in claim 1, wherein the formed portions are cylindrical.

5. The method for micro-perforation of a glass substrate as described in claim 1, wherein the formed portions are cones.

6. The method for micro-perforation of a glass substrate as described in claim 1, wherein the mold is made of titanium alloy.

7. The method for micro-perforation of a glass substrate as described in claim 1, wherein the first surface and the second surface of the glass substrate have a first depth in the first direction, the recess has a second depth in the first direction, and the perforation has a third depth in the first direction, the second depth being greater than the third depth.

8. A method for fabricating micro-perforations on a glass substrate, comprising: The process includes a step of providing a mold and a glass substrate, wherein the mold includes a base and a plurality of forming portions, the glass substrate has a glass transition temperature, and the glass substrate includes a first surface and a second surface opposite to each other, the first surface and the second surface being perpendicularly connected to define a first direction, and the first surface of the glass substrate facing the mold; a heating step of heating the mold and the glass substrate; a hot pressing step of bringing the mold and the glass substrate closer together along the first direction while the glass substrate is heated to the glass transition temperature, wherein the forming portions of the mold penetrate the first surface of the glass substrate to form a plurality of recesses; a cooling step of cooling the mold and the glass substrate; a demolding step of separating the mold from the glass substrate when the glass substrate is cooled to room temperature; a perforation step of penetrating the recesses along the first direction, such that each recess is connected to the second surface to open and form a plurality of perforations; and a thinning step of thinning the thickness of the glass substrate in the first direction from the second surface of the glass substrate.

9. The method for micro-perforation of a glass substrate as described in claim 8, wherein the perforation forming step is performed by laser processing to form the perforations.

10. The method for forming micro-perforations on a glass substrate as described in claim 8, wherein the perforation forming step is performed by etching.

11. The method for micro-perforation of a glass substrate as described in claim 8, wherein the thinning step is accomplished by chemical mechanical polishing.

12. The method for micro-perforation of a glass substrate as described in claim 8, wherein the thinning step is accomplished by mechanical grinding.

13. The method for micro-perforation of a glass substrate as described in claim 8, wherein the formed portions are cylindrical.

14. The method for micro-perforation of a glass substrate as described in claim 8, wherein the formed portions are cones.

15. The method for micro-perforation of a glass substrate as described in claim 8, wherein the mold is made of titanium alloy.

16. The method for micro-perforation of a glass substrate as described in claim 8, wherein the first surface and the second surface of the glass substrate have a first depth in a first direction, the recess has a second depth in the first direction, the first depth being greater than the second depth, and in the perforation forming step, the perforation has a third depth in the first direction, the first depth being greater than the second depth.

17. The method for micro-perforation of a glass substrate as described in claim 16, wherein after the thinning step, the second depth is greater than the third depth.

18. A method for fabricating micro-perforations on a glass substrate, comprising: A step of providing molds and glass substrates includes providing two molds and a glass substrate, each mold comprising a base and a plurality of forming portions, the glass substrate having a glass transition temperature, the glass substrate comprising a first surface and a second surface facing each other, the first surface and the second surface being perpendicularly connected to define a first direction, the first surface and the second surface of the glass substrate facing each mold respectively; a heating step of heating each mold and the glass substrate; a hot pressing step of hot pressing, wherein when the glass substrate is heated to the glass transition temperature, each mold and the glass substrate are brought closer together along the first direction, the forming portions of the mold facing the first surface penetrate through the first surface to form a plurality of first recesses, and the forming portions of the mold facing the second surface penetrate through the second surface to form a plurality of second recesses; wherein the first recesses are individually aligned with the second recesses in the first direction; and a cooling step of cooling the molds and the glass substrate. A demolding step in which the mold separates from the glass substrate when the glass substrate cools to room temperature; and a perforation forming step in which a plurality of perforations are formed by penetrating each of the first recesses and each of the second recesses from the first direction.

19. The method for forming micro-perforations on a glass substrate as described in claim 18, wherein the perforation forming step is performed by laser processing to form the perforations.

20. The method for forming micro-perforations on a glass substrate as described in claim 18, wherein the perforation forming step is performed by etching.

21. The method for forming micro-perforations on a glass substrate as described in claim 18, wherein the perforation forming step is performed by drilling.

Images