Ultra-thin glass substrate processing device and temporary ultra-thin glass carrier assembly

Abstract

The present invention provides an ultra-thin glass substrate processing method, an ultra-thin glass substrate processing device and an ultra-thin glass temporary carrier assembly. The ultra-thin glass substrate processing device includes a substrate carrying module, an adhesive material providing module, a glass bonding module, an adhesive material curing module and a glass processing module. The substrate carrying module is configured to carry a temporary carrying substrate. The adhesive material providing module is configured to provide a reversible adhesive layer on the temporary carrier substrate. The glass bonding module is configured to bond an ultra-thin glass substrate having a thickness of less than

Description

[Technical Field]

[0001] This invention relates to a method for processing a glass substrate, a processing apparatus for a glass substrate, and a temporary glass support assembly, and particularly to a method for processing an ultrathin glass substrate with a thickness of less than 100 µm, a processing apparatus for an ultrathin glass substrate with a thickness of less than 100 µm, and a temporary glass support assembly with a thickness of less than 100 µm. [Previous Technology]

[0002] In the prior art, some processing procedures use vacuum adsorption to fix ultra-thin glass. However, uneven vacuum adsorption increases the risk of breakage of ultra-thin glass, and the alignment accuracy of ultra-thin glass is limited by vacuum adsorption, which is not conducive to the mass production of large-area ultra-thin glass. [Summary of the Invention]

[0003] The problem to be improved or solved by the present invention is to provide a processing method for an ultra-thin glass substrate with a thickness of less than 100 µm, a processing equipment for an ultra-thin glass substrate with a thickness of less than 100 µm, and an ultra-thin glass temporary support component with a thickness of less than 100 µm, in order to address the shortcomings of the prior art.

[0004] To improve or solve the above-mentioned problems, one of the technical means adopted by the present invention is to provide a processing method for an ultrathin glass substrate, which includes: providing an ultrathin glass substrate, wherein the thickness of the ultrathin glass substrate is less than 100 mm. µm; providing a reversible adhesive layer on a temporary support substrate; performing an alignment step on the ultrathin glass substrate and the temporary support substrate with the reversible adhesive layer to adjust the relative positions of the ultrathin glass substrate and the temporary support substrate; performing a bonding step on the ultrathin glass substrate and the temporary support substrate with the reversible adhesive layer to attach the ultrathin glass substrate to the temporary support substrate with the reversible adhesive layer, thereby constituting an ultrathin glass temporary support assembly including at least an ultrathin glass substrate, a reversible adhesive layer and a temporary support substrate; performing a curing step on the reversible adhesive layer of the ultrathin glass temporary support assembly to fix the ultrathin glass substrate on the temporary support substrate; and performing a processing step on the ultrathin glass substrate of the ultrathin glass temporary support assembly to obtain a processed ultrathin glass substrate.

[0005] To improve or solve the above-mentioned problems, another technical means adopted by the present invention is to provide a processing device for an ultra-thin glass substrate, comprising: a signal control module, a substrate support module, an adhesive supply module, a glass bonding module, an adhesive curing module, and a glass processing module. The substrate support module is electrically connected to the signal control module and is configured to support a temporary support substrate. The adhesive supply module is electrically connected to the signal control module and is configured to provide a reversible adhesive layer on the temporary support substrate. The glass bonding module is electrically connected to the signal control module and is configured to attach an ultra-thin glass substrate to the reversible adhesive layer. The adhesive curing module is electrically connected to the signal control module and is configured to cure the reversible adhesive layer, thereby fixing the ultra-thin glass substrate to the temporary support substrate. The glass processing module is electrically connected to the signal control module and is configured to process an ultrathin glass substrate to obtain a processed ultrathin glass substrate. The ultrathin glass substrate, the reversible adhesive layer, and the temporary support substrate are integrated into an ultrathin glass temporary support assembly; wherein the thickness of the ultrathin glass substrate is less than 100 µm.

[0006] To improve or solve the above-mentioned problems, another technical means adopted by the present invention is to provide an ultrathin glass temporary support component, which includes: a temporary support substrate, a reversible adhesive layer, and an ultrathin glass substrate. The reversible adhesive layer is disposed on the temporary support substrate. The processed ultrathin glass substrate is disposed on the reversible adhesive layer. The thickness of the ultrathin glass substrate is less than 100 µm. In one feasible embodiment, the temporary support substrate is configured as a metal substrate, a ceramic substrate, or a polymer substrate, and the thickness of the temporary support substrate is greater than the thickness of the ultrathin glass substrate; a reversible adhesive layer is disposed on the temporary support substrate through an adhesive providing module; the ultrathin glass substrate is disposed on the reversible adhesive layer through the cooperation of a glass bonding module and an adhesive curing module; the ultrathin glass substrate is processed into a processed ultrathin glass substrate through a glass processing module; the thickness of the ultrathin glass substrate is between 30 µm and 100 µm; and when the ultrathin glass substrate is drilled through the glass processing module to form at least one through hole, the extent of the at least one through hole extends to the reversible adhesive layer and the temporary support substrate.

[0007] One of the beneficial effects of the present invention is that the processing method of the ultrathin glass substrate provided by the present invention can achieve the following through the technical solutions: "providing a reversible adhesive layer on a temporary support substrate", "performing a bonding step on the ultrathin glass substrate and the temporary support substrate carrying the reversible adhesive layer to attach the ultrathin glass substrate with a thickness of less than 100 µm to the temporary support substrate carrying the reversible adhesive layer", and "performing a curing step on the reversible adhesive layer of the ultrathin glass temporary support component to fix the ultrathin glass substrate on the temporary support substrate". This allows the ultrathin glass substrate with a thickness of less than 100 µm to be processed through the temporary support (rigid support) of the temporary support substrate, thereby obtaining a processed ultrathin glass substrate.

[0008] Furthermore, the processing equipment for an ultrathin glass substrate provided by the present invention can fix the ultrathin glass substrate on the temporary support substrate by means of the following technical solutions: "an adhesive supply module is configured to provide a reversible adhesive layer on a temporary support substrate", "a glass bonding module is configured to attach an ultrathin glass substrate with a thickness of less than 100 µm to the reversible adhesive layer", and "an adhesive curing module is configured to cure the reversible adhesive layer". This allows an ultrathin glass substrate with a thickness of less than 100 µm to be processed by the temporary support (rigid support) of the temporary support substrate, thereby obtaining a processed ultrathin glass substrate.

[0009] Furthermore, the ultrathin glass temporary support component provided by the present invention can be processed by means of the technical solutions of "a reversible adhesive layer being disposed on a temporary support substrate" and "an ultrathin glass substrate with a thickness of less than 100 µm being disposed on a reversible adhesive layer", so that an ultrathin glass substrate with a thickness of less than 100 µm can be processed by the temporary support (rigid support) of the temporary support substrate, thereby obtaining a processed ultrathin glass substrate.

[0010] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are for reference and illustration only and are not intended to limit the present invention.

Implementation Method

[0011] The following specific embodiments illustrate the implementation methods of the "processing method for ultra-thin glass substrates," "processing equipment for ultra-thin glass substrates," and "temporary support components for ultra-thin glass" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, it should be stated in advance that the drawings of this invention are merely simple illustrations and are not depictions based on actual dimensions. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention. In addition, the term "or" used herein should, as appropriate, include any combination of any one or more of the associated listed items.

[0012] [First Embodiment]

[0013] Referring to Figures 1 to 8, the first embodiment of the present invention provides a method for processing an ultrathin glass substrate, comprising: first, as shown in Figure 1, providing an ultrathin glass substrate 3, wherein the thickness of the ultrathin glass substrate 3 may be less than 100 µm (step S100); next, as shown in Figures 1 and 4, providing a reversible adhesive layer 2 on a temporary support substrate 1 (step S102); then, as shown in Figures 1 and 5, performing an alignment step on the ultrathin glass substrate 3 and the temporary support substrate 1 bearing the reversible adhesive layer 2 (step S104) to adjust the relative positions of the ultrathin glass substrate 3 and the temporary support substrate 1; next, as shown in Figures 1 and 5, performing a bonding step on the ultrathin glass substrate 3 and the temporary support substrate 1 bearing the reversible adhesive layer 2 (step S106) to bond the ultrathin glass substrate 3... The reversible adhesive layer 2 is attached to a temporary support substrate 1 to form an ultrathin glass temporary support assembly S, which includes at least an ultrathin glass substrate 3, a reversible adhesive layer 2, and a temporary support substrate 1. Then, as shown in Figures 1 and 6, a curing step (step S108) is performed on the reversible adhesive layer 2 of the ultrathin glass temporary support assembly S to fix the ultrathin glass substrate 3 to the temporary support substrate 1. And, as shown in Figures 1 and 7, a processing step (step S110) is performed on the ultrathin glass substrate 3 of the ultrathin glass temporary support assembly S to obtain a processed ultrathin glass substrate 4.

[0014] For example, as shown in Figures 1, 2, and 3, before step S102 of providing the reversible adhesive layer 2 on the temporary support substrate 1, the processing method of the ultrathin glass substrate further includes: supporting the temporary support substrate 1 through a substrate support module M2 (e.g., a support module equipped with an organic stage or a carrier stage) (step S1002); and performing a surface treatment process on the temporary support substrate 1 through a surface treatment module M7 (e.g., a surface cleaning device, a surface roughening device, or a plasma treatment machine) (step S1004). It is worth noting that the surface treatment process may include "a cleaning and drying process for removing oil or particles", "a surface roughening process for improving the adhesion of the adhesive (which can form a roughened surface)", "a plasma pretreatment process for improving the adhesion of the adhesive (which can form a roughened surface)" or any kind of destructive or non-destructive surface treatment process. However, the examples given above are only one possible embodiment and are not intended to limit the present invention.

[0015] For example, as shown in Figures 1, 2, and 4, step S102, which provides the reversible adhesive layer 2 on the temporary support substrate 1, further includes: applying (or printing, spraying) or directly attaching the reversible adhesive layer 2 to the temporary support substrate 1 through an adhesive material providing module M3 (e.g., a material coating device, a material printing device, or a material spraying device) (step S1020). It is worth noting that the reversible adhesive layer can be configured as a UV-dissolving adhesive material layer (i.e., a photodissolving adhesive material layer, such as a UV photodissolving adhesive or a UV photodissolving adhesive tape), a thermally released adhesive material layer (i.e., a thermally dissolving adhesive material layer, such as a thermally dissolving adhesive or a thermally dissolving adhesive tape), a chemically solvent-dissolving adhesive material layer (i.e., a liquid dissolving adhesive material layer), or any type of reversible adhesive material layer. Furthermore, the reversible adhesive layer 2 can be pre-cured partially onto the temporary support substrate 1 by means of "brief UV irradiation" or "slow heating". However, the examples given above are merely one possible embodiment and are not intended to limit the present invention.

[0016] For example, as shown in Figures 1, 2, and 5, the bonding step S106 further includes: attaching the ultrathin glass substrate 3 to the reversible adhesive layer 2 via a glass bonding module M4 (e.g., a glass transfer device for adsorbing or clamping glass) (step S1060). It is worth noting that the ultrathin glass substrate 3 can be configured as an initial ultrathin glass substrate that has not yet undergone processing. Furthermore, the bonding step S106 further includes: gently pressing the ultrathin glass substrate 3 in a vacuum or cleanroom environment to eliminate air bubbles formed between the ultrathin glass substrate 3 and the reversible adhesive layer 2 (or to increase the bonding force between the ultrathin glass substrate 3 and the reversible adhesive layer 2). However, the examples given above are merely one possible embodiment and are not intended to limit the invention.

[0017] For example, as shown in Figures 1, 2, and 6, the curing step S108 further includes: curing the reversible adhesive layer 2 through an adhesive curing module M5 (e.g., a photocuring module or a thermocuring module) (step S1080), thereby fixing the ultrathin glass substrate 3 onto the temporary support substrate 1. Furthermore, the adhesive curing module M5 can be configured to provide a predetermined adhesive curing light source (e.g., UV light or laser light) or a predetermined adhesive curing heat source (e.g., a baking heat source or a microheater heat source) to the reversible adhesive layer 2, thereby curing the reversible adhesive layer 2 between the temporary support substrate 1 and the ultrathin glass substrate 3 (or increasing the bonding force between the temporary support substrate 1 and the reversible adhesive layer 2, and increasing the bonding force between the ultrathin glass substrate 3 and the reversible adhesive layer 2). However, the examples given above are merely one possible embodiment and are not intended to limit the present invention.

[0018] It is worth noting that, for example, after the curing step S108, the processing method of the ultrathin glass substrate further includes: performing a high temperature resistance test, an acid corrosion resistance test, or an alkali corrosion resistance test on the ultrathin glass temporary support component S.

[0019] For example, in a high-temperature resistance test of the ultrathin glass temporary support component S, the ultrathin glass temporary support component S can be placed in a high-temperature, high-vacuum environment of 550°C and 10⁻⁶ torr for testing. The test results show that the reversible adhesive layer 2 of the ultrathin glass temporary support component S does not produce bubbles or peeling, and the ultrathin glass substrate 3 of the ultrathin glass temporary support component S does not produce warping or cracks. Therefore, the ultrathin glass temporary support component S can be used in high-temperature or high-vacuum processes. However, the above-mentioned examples are only one feasible embodiment and are not intended to limit the present invention.

[0020] For example, in a step of testing the acid resistance of the ultrathin glass temporary support component S, the ultrathin glass temporary support component S can be immersed in an acidic etchant (e.g., BOE or oxalic acid solution) at room temperature (approximately 23°C). The test results show that the acidic etchant does not penetrate between the "ultrathin glass substrate 3 and reversible adhesive layer 2" and between the "temporary support substrate 1 and reversible adhesive layer 2," and the ultrathin glass temporary support component S does not exhibit edge delamination or cracking damage. Therefore, the ultrathin glass temporary support component S can be stably used in processes with acidic environments. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0021] For example, in a step of testing the alkaline corrosion resistance of the ultrathin glass temporary support component S, the ultrathin glass temporary support component S can be immersed in an alkaline etchant (e.g., TMAH solution) at room temperature (approximately 23°C). The test results show that the alkaline etchant does not penetrate between the "ultrathin glass substrate 3 and reversible adhesive layer 2" and between the "temporary support substrate 1 and reversible adhesive layer 2," and the ultrathin glass temporary support component S does not exhibit edge delamination or cracking damage. Therefore, the ultrathin glass temporary support component S can be stably used in processes with alkaline environments. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0022] For example, as shown in Figures 1, 2, and 7, processing step S110 further includes: using a glass processing module M6 (e.g., a thinning processing device, drilling device, cutting device, semiconductor device, or any type of processing device) to thin, drill (e.g., form at least one through hole 401 or at least one blind hole 402), cut (e.g., form at least one cutting path 403), or remove glass material from the ultrathin glass substrate 3, and using the ultrathin glass substrate 3 as a substrate for semiconductor processes (e.g., metallization, exposure and development, etching), printed circuit board processes, or liquid crystal display processes. Furthermore, since the temporary support substrate 1 can provide the ultrathin glass substrate 3 with a predetermined strength of rigid support, the ultrathin glass substrate 3 will not experience "fracture due to excessive thinness" or "deformation due to thermal stress." It is worth noting that, as shown in FIG7, in one feasible embodiment, when the ultrathin glass substrate 3 is drilled through the glass processing module M6 to form at least one through hole 401, the range of the at least one through hole 401 can extend through the reversible adhesive layer 2 and to the temporary support substrate 1, or the range of the at least one through hole 401 can extend only to the reversible adhesive layer 2 (similar to the extension range of the at least one dicing 403). Furthermore, in one feasible embodiment, when the ultrathin glass substrate 3 is drilled through the glass processing module M6 to form at least one blind hole 402, the at least one blind hole 402 is formed only within the processed ultrathin glass substrate 4 and does not extend to the reversible adhesive layer 2 and the temporary support substrate 1. However, the examples given above are merely feasible embodiments and are not intended to limit the present invention.

[0023] For example, as shown in Figures 1, 2, and 8, after processing step S110, the processing method for the ultrathin glass substrate further includes: performing a separation step (step S112) on the processed ultrathin glass substrate 4, wherein the separation step may include: allowing the processed ultrathin glass substrate 4 to separate from the reversible adhesive layer 2 through a glass debonding module M8 (e.g., a light source providing module or a heat source providing module). Furthermore, the glass debonding module M8 may be configured to provide a predetermined debonding light source (e.g., UV light or laser light) or a predetermined debonding heat source (e.g., a baking heat source or a microheater heat source) to the reversible adhesive layer 2, thereby reducing the adhesion (or bonding force) between the processed ultrathin glass substrate 4 and the reversible adhesive layer 2. However, the examples given above are merely one possible embodiment and are not intended to limit the present invention.

[0024] For example, as shown in Figures 1 and 2, after the separation step S112, the processing method of the ultra-thin glass substrate further includes: performing a cleaning step (step S114) on the processed ultra-thin glass substrate 4, wherein the cleaning step may include: cleaning the processed ultra-thin glass substrate 4 and the temporary support substrate 1 through a glass cleaning module M9 (e.g., a cleaning agent supply device or any type of cleaning device). Furthermore, the glass cleaning module M9 may be configured to provide a predetermined cleaning agent (e.g., a solvent or any adhesive remover, or any adhesive removal method) to the processed ultra-thin glass substrate 4, thereby removing foreign matter attached to the processed ultra-thin glass substrate 4. It is worth noting that in one feasible embodiment, after the cleaning step S114, the processed ultra-thin glass substrate 4 may be applied to a display substrate, a sensor substrate, a multilayer circuit board, or an advanced packaging element. However, the examples given above are merely feasible embodiments and are not intended to limit the present invention.

[0025] For example, as shown in Figures 1 and 2, after cleaning step S114, the processing method of the ultrathin glass substrate further includes: performing a recycling step (step S116) on the temporary support substrate 1 to reuse the temporary support substrate 1 (that is, recycling and reusing the temporary support substrate 1). In addition, after cleaning step S116, the processing method of the ultrathin glass substrate further includes: performing an inspection step (step S118) on the processed ultrathin glass substrate 4, wherein the inspection step may include: inspecting a predetermined appearance of the processed ultrathin glass substrate 4 through an appearance inspection module M10 (e.g., an image capturing device or an image sensing device); and inspecting a predetermined function of the processed ultrathin glass substrate 4 through a function inspection module M11 (e.g., an optical inspection device or an electrical inspection device). Furthermore, in one feasible embodiment, the predetermined appearance of the processed ultrathin glass substrate 4 can be surface flatness, surface bubbles, surface cracks, structural warping, residual foreign matter, or any other appearance inspection, and the predetermined function of the processed ultrathin glass substrate 4 can be electrical function, optical function, or any functional detection. However, the examples given above are merely feasible embodiments and are not intended to limit the present invention.

[0026] Furthermore, in conjunction with Figures 2 to 8, the first embodiment of the present invention further provides a processing device M for an ultra-thin glass substrate, which includes: a signal control module M1, a substrate carrying module M2, an adhesive supply module M3, a glass bonding module M4, an adhesive curing module M5, and a glass processing module M6.

[0027] Furthermore, as shown in Figures 2 and 3, the substrate carrier module M2 (e.g., a carrier module equipped with an organic stage or platform) can be electrically connected to the signal control module M1, and the substrate carrier module M2 can be configured to carry a temporary carrier substrate 1. For example, the temporary carrier substrate 1 can be configured as a metal substrate, a ceramic substrate, a polymer substrate, or any carrier substrate with a coefficient of thermal expansion or a heat transfer coefficient similar to that of the ultrathin glass substrate 3, and the thickness of the temporary carrier substrate 1 can be greater than the thickness of the ultrathin glass substrate 3. However, the examples given above are merely one possible embodiment and are not intended to limit the present invention.

[0028] Furthermore, in conjunction with Figures 2 and 4, the adhesive supply module M3 (e.g., a material coating device, a material printing device, or a material spraying device) can be electrically connected to the signal control module M1, and the adhesive supply module M3 can be configured to provide a reversible adhesive layer 2 onto the temporary support substrate 1 (that is, the reversible adhesive layer 2 can be disposed on the temporary support substrate 1 through the adhesive supply module M3). For example, the adhesive supply module M3 can be configured to coat (or print, spray) or directly attach the reversible adhesive layer 2 onto the temporary support substrate 1. It is worth noting that the reversible adhesive layer can be configured as a UV-dissolving adhesive layer (i.e., a photodissolving adhesive layer, such as UV photodissolving adhesive or UV photodissolving adhesive tape), a heat-releasing adhesive layer (i.e., a heat-dissolving adhesive layer, such as heat-dissolving adhesive or heat-dissolving adhesive tape), a chemical solvent-dissolving adhesive layer (i.e., a liquid dissolving adhesive layer), or any type of reversible adhesive layer. Furthermore, the reversible adhesive layer 2 can be pre-cured partially on the temporary support substrate 1 by means of "brief UV irradiation" or "slow heating." However, the examples given above are merely one possible embodiment and are not intended to limit the invention.

[0029] Furthermore, in conjunction with Figures 2 and 5, the glass bonding module M4 (e.g., a glass transfer device for adsorbing or clamping glass) can be electrically connected to the signal control module M1, and the glass bonding module M4 can be configured to attach an ultrathin glass substrate 3 to the reversible adhesive layer 2 (that is, the ultrathin glass substrate 3 can be disposed on the reversible adhesive layer 2 through the glass bonding module M4). For example, the thickness of the ultrathin glass substrate 3 can be less than 100 µm (e.g., the thickness can be any positive integer less than 100 µm). In a feasible embodiment, the thickness of the ultrathin glass substrate 3 can be between 30 µm and 100 µm (e.g., the thickness can be any positive integer between 30 µm and 100 µm). It is worth noting that, in one feasible embodiment, the present invention may use a glass pressing module (not shown) to gently press the ultrathin glass substrate 3 in a vacuum or cleanroom environment, thereby eliminating air bubbles formed between the ultrathin glass substrate 3 and the reversible adhesive layer 2 (or increasing the bonding force between the ultrathin glass substrate 3 and the reversible adhesive layer 2). However, the examples given above are merely feasible embodiments and are not intended to limit the present invention.

[0030] Furthermore, as shown in Figures 2 and 6, the adhesive curing module M5 (e.g., a photocuring module or a thermocuring module) can be electrically connected to the signal control module M1, and the adhesive curing module M5 can be configured to cure the reversible adhesive layer 2, thereby fixing the ultrathin glass substrate 3 onto the temporary support substrate 1 (that is, the ultrathin glass substrate 3 can be fixed onto the reversible adhesive layer 2 through the adhesive curing module M5). It is worth noting that the ultrathin glass substrate 3, the reversible adhesive layer 2, and the temporary support substrate 1 can be integrated into an ultrathin glass temporary support component S. For example, the adhesive curing module M5 can be configured to provide a predetermined adhesive curing light source (e.g., UV light or laser light) or a predetermined adhesive curing heat source (e.g., baking heat source or microheater heat source) to the reversible adhesive layer 2, thereby curing the reversible adhesive layer 2 between the temporary support substrate 1 and the ultrathin glass substrate 3 (or increasing the bonding force between the temporary support substrate 1 and the reversible adhesive layer 2, and increasing the bonding force between the ultrathin glass substrate 3 and the reversible adhesive layer 2). However, the examples given above are merely one possible embodiment and are not intended to limit the present invention.

[0031] Furthermore, in conjunction with Figures 2 and 7, the glass processing module M6 (e.g., a thinning process, drilling process, cutting process, semiconductor process, or any type of processing equipment) can be electrically connected to the signal control module M1, and the glass processing module M6 can be configured to process the ultra-thin glass substrate 3, thereby obtaining a processed ultra-thin glass substrate 4 (that is, the ultra-thin glass substrate 3 can be processed by the glass processing module M6 to form a processed ultra-thin glass substrate 4). For example, the glass processing module M6 can be configured to thin, drill (e.g., form at least one through hole 401 or at least one blind hole 402), cut (e.g., form at least one slit 403), or remove glass material from the ultra-thin glass substrate 3, and the glass processing module M6 can be configured to perform semiconductor processes (e.g., metallization, exposure and development, etching on the ultra-thin glass substrate 3), printed circuit board processes, or liquid crystal display processes on the ultra-thin glass substrate 3 as a substrate. Furthermore, since the temporary support substrate 1 can provide the ultrathin glass substrate 3 with a predetermined strength of rigid support, the ultrathin glass substrate 3 will not experience "fracture due to excessive thinness" or "deformation due to thermal stress." It is worth noting that, as shown in FIG7, in one feasible embodiment, when the ultrathin glass substrate 3 is drilled through the glass processing module M6 to form at least one through-hole 401, the range of the at least one through-hole 401 can extend through the reversible adhesive layer 2 and to the temporary support substrate 1, or the range of the at least one through-hole 401 can extend only to the reversible adhesive layer 2 (similar to the extension range of at least one kerf 403). Additionally, in one feasible embodiment, when the ultrathin glass substrate 3 is drilled through the glass processing module M6 to form at least one blind hole 402, the at least one blind hole 402 is formed only within the processed ultrathin glass substrate 4 and does not extend to the reversible adhesive layer 2 and the temporary support substrate 1. However, the examples given above are merely feasible embodiments and are not intended to limit the present invention.

[0032] Furthermore, in conjunction with Figures 2 and 3, the ultrathin glass substrate processing equipment M provided in the first embodiment of the present invention further includes: a surface treatment module M7 (e.g., a surface cleaning device, a surface roughening device, or a plasma treatment machine). The surface treatment module M7 can be electrically connected to the signal control module M1, and the surface treatment module M7 can be configured to perform a surface treatment process on the temporary support substrate 1. For example, the surface treatment process may include "a cleaning and drying process for removing oil or particles", "a surface roughening process for improving the adhesion of adhesives (which can form a roughened surface)", "a plasma pretreatment process for improving the adhesion of adhesives (which can form a roughened surface)", or any kind of destructive or non-destructive surface treatment process. However, the examples given above are only one possible embodiment and are not intended to limit the present invention.

[0033] Furthermore, in conjunction with Figures 2 and 8, the ultrathin glass substrate processing equipment M provided in the first embodiment of the present invention further includes: a glass debonding module M8 (e.g., a light source providing module or a heat source providing module). The glass debonding module M8 can be electrically connected to the signal control module M1, and the glass debonding module M8 can be configured to allow the processed ultrathin glass substrate 4 to separate from the reversible adhesive layer 2. For example, the glass debonding module M8 can be configured to provide a predetermined debonding light source (e.g., UV light or laser light) or a predetermined debonding heat source (e.g., a baking heat source or a microheater heat source) to the reversible adhesive layer 2, thereby reducing the adhesion (or bonding force) between the processed ultrathin glass substrate 4 and the reversible adhesive layer 2. However, the examples given above are only one possible embodiment and are not intended to limit the present invention.

[0034] Furthermore, as shown in FIG. 2, the ultra-thin glass substrate processing equipment M provided in the first embodiment of the present invention further includes: a glass cleaning module M9 (e.g., a cleaning agent supply device or any kind of cleaning device). The glass cleaning module M9 can be electrically connected to the signal control module M1, and the glass cleaning module M9 can be configured to clean the processed ultra-thin glass substrate 4 and the temporary support substrate 1. For example, the glass cleaning module M9 can be configured to provide a predetermined cleaning agent (e.g., a solvent or any adhesive remover, or any adhesive remover method) to the processed ultra-thin glass substrate 4, thereby removing foreign matter attached to the processed ultra-thin glass substrate 4. It is worth noting that, in one feasible embodiment, after the processed ultra-thin glass substrate 4 is cleaned by the glass cleaning module M9, the processed ultra-thin glass substrate 4 can be applied to a display substrate, a sensor substrate, a multilayer circuit board, or an advanced packaging element. However, the examples given above are only feasible embodiments and are not intended to limit the present invention.

[0035] Furthermore, as shown in FIG2, the ultrathin glass substrate processing equipment M provided in the first embodiment of the present invention further includes: an appearance inspection module M10 (e.g., an image capturing device or an image sensing device). The appearance inspection module M10 can be electrically connected to the signal control module M1, and the appearance inspection module M10 can be configured to inspect a predetermined appearance of the processed ultrathin glass substrate 4. For example, in one feasible embodiment, the predetermined appearance of the processed ultrathin glass substrate 4 can be surface flatness, surface bubbles, surface cracks, structural warping, residual foreign matter, or any appearance inspection. However, the examples given above are only feasible embodiments and are not intended to limit the present invention.

[0036] Furthermore, as shown in FIG2, the ultrathin glass substrate processing equipment M provided in the first embodiment of the present invention further includes: a function detection module M11 (e.g., an optical detection device or an electrical detection device). The function detection module M11 can be electrically connected to the signal control module M1, and the function detection module M11 can be configured to detect a predetermined function of the processed ultrathin glass substrate 4. For example, the predetermined function of the processed ultrathin glass substrate 4 can be an electrical function, an optical function, or any functional detection. However, the examples given above are only one possible embodiment and are not intended to limit the present invention.

[0037] [Second Embodiment]

[0038] Referring to Figures 1, 2, 9, and 10, the second embodiment of the present invention provides a method for processing an ultrathin glass substrate and a processing apparatus M for an ultrathin glass substrate. The main difference between the second embodiment and the first embodiment is that, after processing step S110, the method for processing an ultrathin glass substrate provided in the second embodiment further includes a transfer step (step S120) on the processed ultrathin glass substrate 4, wherein the transfer step may include: stacking the processed ultrathin glass substrate 4 (i.e., the processed ultrathin glass substrate 4 located at the top in Figures 9 and 10) onto another processed ultrathin glass substrate 4 (i.e., the processed ultrathin glass substrate 4 located at the bottom in Figures 9 and 10) through a substrate transfer module M12 (e.g., a substrate adsorption device or a substrate clamping device). In this way, two or more processed ultrathin glass substrates 4 can be stacked multiple times to electrically connect with each other, thereby forming a multilayer glass circuit board or an advanced packaging stack structure. Furthermore, the ultrathin glass substrate processing equipment M provided in the second embodiment of the present invention further includes a substrate transfer module M12. The substrate transfer module M12 can be electrically connected to the signal control module M1, and the substrate transfer module M12 can be configured to stack the processed ultrathin glass substrate 4 on another processed ultrathin glass substrate 4, thereby forming a multilayer glass circuit board or an advanced packaging stack structure.

[0039] [Beneficial Effects of the Embodiments]

[0040] One of the beneficial effects of the present invention is that the processing method of the ultrathin glass substrate provided by the present invention can, through the technical solutions of "providing a reversible adhesive layer 2 on a temporary support substrate 1", "performing a bonding step on the ultrathin glass substrate 3 and the temporary support substrate 1 carrying the reversible adhesive layer 2 to attach the ultrathin glass substrate 3 with a thickness of less than 100 µm to the temporary support substrate 1 carrying the reversible adhesive layer 2", and "performing a curing step on the reversible adhesive layer 2 of the ultrathin glass temporary support component S to fix the ultrathin glass substrate 3 on the temporary support substrate 1", make the ultrathin glass substrate 3 with a thickness of less than 100 µm able to be processed through the temporary support (rigid support) of the temporary support substrate 1, thereby obtaining a processed ultrathin glass substrate 4.

[0041] Furthermore, the ultrathin glass substrate processing equipment M provided by the present invention can, through the technical solutions of "adhesive material supply module M3 can be configured to provide a reversible adhesive layer 2 on a temporary support substrate 1", "glass bonding module M4 can be configured to attach an ultrathin glass substrate 3 with a thickness of less than 100 µm to the reversible adhesive layer 2" and "adhesive material curing module M5 can be configured to cure the reversible adhesive layer 2, thereby fixing the ultrathin glass substrate 3 on the temporary support substrate 1", so that the ultrathin glass substrate 3 with a thickness of less than 100 µm can be processed through the temporary support (rigid support) of the temporary support substrate 1, thereby obtaining a processed ultrathin glass substrate 4.

[0042] Furthermore, the ultrathin glass temporary support component S provided by the present invention can be processed by means of the technical solution of "reversible adhesive layer 2 disposed on temporary support substrate 1" and "ultrathin glass substrate 3 with a thickness of less than 100 µm disposed on reversible adhesive layer 2", so that the ultrathin glass substrate 3 with a thickness of less than 100 µm can be processed by the temporary support (rigid support) of temporary support substrate 1, thereby obtaining a processed ultrathin glass substrate 4.

[0043] It is worth noting that when the "processing method for ultra-thin glass substrate", "processing equipment M for ultra-thin glass substrate" and "temporary support component S for ultra-thin glass" provided by the present invention are applied to existing production line equipment (such as semiconductor manufacturing process, printed circuit board manufacturing process or liquid crystal display manufacturing process), the problem that ultra-thin glass substrate 3 with a thickness of less than 100 µm is difficult to process due to its fragility (cracks) and deformation (warping) can be solved, thereby improving the production yield and industrial application of ultra-thin glass substrate 3 with a thickness of less than 100 µm.

[0044] The content disclosed above is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention specification and drawings are included in the scope of the patent application of the present invention. [Simplified Explanation of the Diagram]

[0045] Figure 1 is a flowchart of a processing method for an ultrathin glass substrate provided by the present invention.

[0046] Figure 2 is a functional block diagram of a processing equipment for an ultra-thin glass substrate provided by the present invention.

[0047] Figure 3 is a schematic diagram of steps S1002 and S1004 of the processing method of the ultrathin glass substrate provided in the first embodiment of the present invention.

[0048] Figure 4 is a schematic diagram of steps S102 and S1020 of the processing method of the ultrathin glass substrate provided in the first embodiment of the present invention.

[0049] Figure 5 is a schematic diagram of steps S104, S106 and S1060 of the processing method of the ultrathin glass substrate provided in the first embodiment of the present invention.

[0050] Figure 6 is a schematic diagram of steps S108 and S1080 of the processing method of the ultrathin glass substrate provided in the first embodiment of the present invention.

[0051] Figure 7 is a schematic diagram of step S110 of the processing method of the ultrathin glass substrate provided in the first embodiment of the present invention.

[0052] Figure 8 is a schematic diagram of step S112 of the processing method of the ultrathin glass substrate provided in the first embodiment of the present invention.

[0053] Figure 9 is a schematic diagram of step S120 of the processing method of the ultrathin glass substrate provided in the second embodiment of the present invention.

[0054] Figure 10 is a schematic diagram of two processed ultrathin glass substrates stacked together according to the second embodiment of the present invention.

Claims

1. A processing apparatus for ultrathin glass substrates, comprising: One signal control module; A substrate support module electrically connected to the signal control module, the substrate support module being configured to support a temporary support substrate; an adhesive supply module electrically connected to the signal control module, the adhesive supply module being configured to provide a reversible adhesive layer on the temporary support substrate; and a glass bonding module electrically connected to the signal control module, the glass bonding module being configured to attach an ultrathin glass substrate to the reversible adhesive layer. An adhesive curing module electrically connected to the signal control module is configured to cure the reversible adhesive layer to fix the ultrathin glass substrate onto the temporary support substrate; and a glass processing module electrically connected to the signal control module is configured to process the ultrathin glass substrate to obtain a processed ultrathin glass substrate; wherein the ultrathin glass substrate, the reversible adhesive layer, and the temporary support substrate are integrated into an ultrathin glass temporary support assembly; and wherein the thickness of the ultrathin glass substrate is less than 100 µm.

2. The processing equipment for ultrathin glass substrates as described in claim 1, wherein, The adhesive material supply module is configured to apply or attach the reversible adhesive layer to the temporary support substrate, and the reversible adhesive layer is configured as a UV-release adhesive layer, a heat-release adhesive layer, or a chemical solvent-soluble adhesive layer; wherein, the adhesive material curing module is configured to provide a predetermined curing light source or a predetermined curing heat source to the reversible adhesive layer, thereby curing the reversible adhesive layer between the temporary support substrate and the ultra-thin glass substrate; wherein, the glass processing module is configured to thin, drill, or cut the ultra-thin glass substrate; wherein, the glass processing module is configured to perform semiconductor processing, printed circuit board processing, or liquid crystal display processing on the ultra-thin glass substrate; and wherein, when the ultra-thin glass substrate is drilled through the glass processing module to form at least one through hole, the at least one through hole extends to the reversible adhesive layer and the temporary support substrate.

3. The processing equipment for ultrathin glass substrates as described in claim 1, further comprising: A surface treatment module electrically connected to the signal control module, the surface treatment module being configured to perform a surface treatment process on the temporary support substrate; A glass debonding module electrically connected to the signal control module, the glass debonding module being configured to allow the processed ultrathin glass substrate to separate from the reversible adhesive layer; a glass cleaning module electrically connected to the signal control module, the glass cleaning module being configured to clean the processed ultrathin glass substrate and the temporary support substrate; and an appearance inspection module electrically connected to the signal control module, the appearance inspection module being configured to inspect a predetermined appearance of the processed ultrathin glass substrate. A function detection module is electrically connected to the signal control module and is configured to detect a predetermined function of the processed ultrathin glass substrate. And a substrate transfer module electrically connected to the signal control module, the substrate transfer module being configured to stack the processed ultrathin glass substrate on another processed ultrathin glass substrate.

4. The processing equipment for ultrathin glass substrates as described in claim 3, wherein, The surface treatment process includes a cleaning and drying process for removing oil or particles, a surface roughening process for improving adhesive adhesion, or a plasma pretreatment process for improving adhesive adhesion; wherein the glass debonding module is configured to provide a predetermined debonding light source or a predetermined debonding heat source to the reversible adhesive layer, thereby reducing the adhesion between the processed ultrathin glass substrate and the reversible adhesive layer; wherein the glass cleaning module is configured to provide a predetermined cleaning agent to the processed ultrathin glass substrate, thereby removing foreign matter adhering to the processed ultrathin glass substrate; wherein the predetermined appearance of the processed ultrathin glass substrate is surface flatness, surface bubbles, surface cracks, structural warping, or residual foreign matter; and wherein the predetermined function of the processed ultrathin glass substrate is an electrical function or an optical function.

5. An ultrathin glass temporary support component, comprising: A temporary substrate; A reversible adhesive layer is disposed on the temporary support substrate; The system also includes an ultrathin glass substrate disposed on the reversible adhesive layer; wherein the thickness of the ultrathin glass substrate is less than 100 µm; wherein the reversible adhesive layer is disposed on the temporary support substrate via an adhesive material providing module; wherein the ultrathin glass substrate is disposed on the reversible adhesive layer via the cooperation of a glass bonding module and an adhesive material curing module; wherein the ultrathin glass substrate is processed into a processed ultrathin glass substrate via a glass processing module; wherein when the ultrathin glass substrate is drilled through the glass processing module to form at least one through hole, the at least one through hole extends to the reversible adhesive layer and the temporary support substrate.

6. The ultrathin glass temporary support assembly as described in claim 5, wherein, The temporary support substrate is configured as a metal substrate, a ceramic substrate, or a polymer substrate, and the thickness of the temporary support substrate is greater than the thickness of the ultrathin glass substrate; wherein the thickness of the ultrathin glass substrate is between 30 µm and 100 µm.

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