Method for manufacturing heat dissipation structure of composite material
TW202637516APending Publication Date: 2026-09-16CMTEK CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- TW114108028
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-03-05
- Publication Date
- 2026-09-16
Smart Images

Figure TWG2TA001075566_001 
Figure TWG2TA001075566_002 
Figure TWG2TA001075566_003
Abstract
A method for manufacturing a heat dissipation structure of a composite material includes the following steps. The first step is providing a rigid porous carrier. The rigid porous carrier is made of a hard material including silicon carbide. The next step is performing a metal vapor infiltration treatment on the rigid porous carrier. The metal vapor infiltration treatment includes vaporizing a melt of a highly thermally conductive metal material to produce a vapor mixture that penetrates into pores of the rigid porous carrier. Therefore, the pores in the rigid porous carrier can be fully filled with the highly thermally conductive metal material, so as to improve thermal performance.
Need to check novelty before this filing date? Find Prior Art
