Photocurable resin composition, cured product, laminate, method for manufacturing cured product, method for manufacturing laminate, method for manufacturing semiconductor device, semiconductor device and photoalkali generator.
TW202637529APending Publication Date: 2026-09-16FUJIFILM CORP
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Patent Information
- Application Number
- TW114150050
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-25
- Filing Date
- 2025-12-19
- Publication Date
- 2026-09-16
Abstract
The present invention provides a photocurable resin composition, a cured product obtained by curing the photocurable resin composition, a laminate containing the cured product, a method for manufacturing the cured product, a method for manufacturing the laminate, a method for manufacturing a semiconductor device including the method for manufacturing the cured product, a semiconductor device containing the cured product, and a novel alkali generating agent. The photocurable resin composition contains a compound represented by formula (A-1) and a resin as a polyimide precursor having a polymerizable group.
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