Inhibitor composition, inhibitor pattern formation method, compound, acid generating agent, acid diffusion control agent, and polymer compound

TW202637531APending Publication Date: 2026-09-16TOKYO OHKA KOGYO CO LTD
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Patent Information

Application Number
TW114149830
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-20
Filing Date
2025-12-18
Publication Date
2026-09-16
Patent Text Reader

Abstract

This invention employs a resist composition that generates acid upon exposure and alters the solubility of the developer due to the acid's action, and comprises a compound with a cation represented by general formula (c0). In the formula, R01 and R02 independently represent aryl, alkyl, or alkenyl groups, each potentially having substituents. R01 and R02 can also be bonded together to form a ring with the sulfur atom in the formula. R03 represents a substituent. k is an integer from 0 to 3. Based on this resist composition, high sensitivity and improved / reduced roughness in microlithography can be achieved, thereby suppressing defect formation.
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