Photosensitive or radiosensitive linear resin compositions, photoresist films, patterning methods, and manufacturing methods of electronic devices.
TW202637532APending Publication Date: 2026-09-16FUJIFILM CORP
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Patent Information
- Application Number
- TW115100150
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-01-08
- Filing Date
- 2026-01-02
- Publication Date
- 2026-09-16
Abstract
This invention relates to photosensitive radioactive or radioactive linear resin compositions, and photoresist films, patterning methods, and manufacturing methods of electronic devices using the aforementioned photosensitive radioactive or radioactive linear resin compositions. The aforementioned photosensitive radioactive or radioactive linear resin compositions contain: a compound comprising an anion having a pKa of 5.0 or less, including a cation having a specific structure and a conjugate acid; an acid-degradable resin; and a solvent.
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