Modifier for improving the dielectric properties of thermosetting resin compositions

Abstract

The objective of this invention is to provide a modifier for thermosetting resin compositions exhibiting excellent dielectric properties. According to the invention, a dielectric property modifier comprising a monomeric compound of general formula 1 having a structure with phosphorus and nitrogen atom bonds or a polymeric compound of general formula 2 is provided, along with a compound for use with the modifier. This modifier can be added as a modifier to thermosetting resins such as epoxy resins and polyphenylene ether resins having vinyl unsaturated bonds. Furthermore, the invention also provides a thermosetting resin composition containing the modifier and a thermosetting resin. This thermosetting resin composition exhibits a low dielectric loss tangent and achieves excellent dielectric properties.

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