Resin composition, cured material, laminate, method for manufacturing cured material, method for manufacturing laminate, method for manufacturing semiconductor device and semiconductor device, and polyimide and method for synthesizing polyimide.

Abstract

The present invention provides a resin composition, a cured product formed by curing the resin composition, a laminate containing the cured product, a method for manufacturing the cured product, a method for manufacturing the laminate, a method for manufacturing a semiconductor device including the method for manufacturing the cured product, a semiconductor device containing the cured product, and a novel polyimide and a method for synthesizing the same, wherein the resin composition contains polyimide, and the polyimide is a copolymer comprising blocks formed by repeating units represented by formula (1-1) and blocks formed by repeating units represented by formula (1-2), and satisfies all of the following conditions 1, 2 and 3.