Photosensitive resin composition, resin curing film, and image display element

TW202637629APending Publication Date: 2026-09-16RESONAC CORP
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Patent Information

Application Number
TW114151049
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-01-06
Filing Date
2025-12-24
Publication Date
2026-09-16
Patent Text Reader

Abstract

A photosensitive resin composition comprising: a copolymer (A), a photopolymerization initiator (C), and a solvent (D), wherein the copolymer (A) comprises: a structural unit (a) having a capped isocyanate group, and a structural unit (b) having a partial structure of formula (1) below, and the copolymer (A) has a hydroxyl equivalent of 100~5000 g / mol, an acid value of 5~400 KOH mg / g, and an unsaturated group equivalent of 30~3000 g / mol. (In formula (1), R1 is a divalent hydrocarbon group, and n1 represents an integer from 2 to 20.)
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