Acrylic resin mixtures, resin compositions, cured materials, printed wiring boards, semiconductor sealing materials, and enhancement films

Abstract

[Objective] The objective of this invention is to provide a acrylic resin mixture that provides formability suitable for conventional manufacturing processes and, upon curing, a high degree of heat resistance and low moisture absorption. [Solution] An acrylic resin mixture characterized in that it contains one or more acrylic resins selected from the group consisting of acrylic resins represented by general formulas (1) and (2), wherein X(moles%), calculated by mathematical formula (1): X(moles%) = Gr11 + Gr12, is 10 moles or more. none

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