Polyamide-imide resin, polyamide-imide resin for insulating materials, resin compositions, films and printed circuit boards
TW202637640APending Publication Date: 2026-09-16RESONAC CORP
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Patent Information
- Application Number
- TW115108425
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-10
- Filing Date
- 2026-03-09
- Publication Date
- 2026-09-16
Abstract
A resin composition comprising a polyamide-imide resin (I) having a relative permittivity of less than 3.0 at 10 GHz.
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