composition

Abstract

The present invention encompasses compositions to be used for fabricating a thin film encapsulant for an electronic device, comprising (a) polycycloolefin monomer(s), (b) catalyst, (c) photoactive compound and (d) crosslinker(s). The composition of the present invention may be used to make semiconductor device / display device application, for example semiconductor chip, or a liquid crystal, quantum dot, μLED and OLED display fabricated on a substrate controlled by semiconductors.