Curable resin composition and its cured products

TW202637645APending Publication Date: 2026-09-16NIPPON KAYAKU CO LTD
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Patent Information

Application Number
TW115106177
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-18
Filing Date
2026-02-13
Publication Date
2026-09-16

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Abstract

This invention provides a curable resin composition and its cured product that exhibit excellent adhesion to copper foil, low hygroscopicity, low dielectric properties, and resistance to oxidative degradation. A curable resin composition comprises: a maleimide resin having a maleimide equivalent of 730 g / eq or less and having at least one structure represented by the following formula (1) within the molecule; and a copolymer comprising ethylene, styrene, and divinylbenzene. (In formula (1), Al is an aliphatic hydrocarbon group having 1 to 60 carbon atoms.)
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