Curable resin materials, prepregs, resin films, metal-coated laminates, printed circuit boards, and semiconductor packages.
TW202637662APending Publication Date: 2026-09-16RESONAC CORP
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Patent Information
- Application Number
- TW114148139
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-12
- Filing Date
- 2025-12-09
- Publication Date
- 2026-09-16
Abstract
The present invention is a curable resin material comprising a polymerizable compound (A) and an inorganic filler (B), wherein the polymerizable compound (A) comprises a resin (A1) comprising an indenyl ring, a vinylbenzyl group and an aralkyl group other than the vinylbenzyl group.
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