Bio-based urethane (METH)acrylate compound for preparing a dual curable adhesive composition used in electronic devices
TW202637667APending Publication Date: 2026-09-16HENKEL KGAA
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Patent Information
- Application Number
- TW114147000
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-03
- Filing Date
- 2025-12-02
- Publication Date
- 2026-09-16
Abstract
The present invention relates to a bio-based urethane (meth)acrylate compound for preparing a dual curable adhesive composition used in electronic devices. In particular, the present invention relates to a bio-based urethane (meth)acrylate compound exhibiting a high bio-based components and designed for use in a radiation- and moisture- dual curable adhesive composition for electronic devices.
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