Epoxy resin composition, cured material, semiconductor device, and method for manufacturing semiconductor device

TW202637670APending Publication Date: 2026-09-16NAMICS CORPORATION
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Patent Information

Application Number
TW114145555
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-25
Filing Date
2025-11-21
Publication Date
2026-09-16

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Abstract

This invention provides an epoxy resin composition that prevents warping of the molded wafer. The invention is an epoxy resin composition comprising epoxy resin (A), a curing accelerator (B), and an inorganic filler (C), characterized in that epoxy resin (A) comprises an epoxy resin (A1) having glycidyl ether groups, polyethylene glycol groups, and / or polypropylene glycol groups.
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