Curable composition and insulating film

Abstract

The present disclosure provides a curable composition comprising (a) an epoxy resin; (b) a hardener; (c) a curing catalyst; (d) boron nitride as fillers; and (e) an optional additive. The present disclosure also provides an insulating film comprising the aforementioned curable composition, which are particularly suited for manufacturing printed circuit boards (PCBs). The insulating film exhibit excellent electrical properties, including low dissipation factor (Df) and a low coefficient of thermal expansion (CTE). Furthermore, the insulating film provides significant advantages in reducing the production time in PCB manufacturing processes that involve a plasma etching step.

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