Negative photosensitive resin composition, cured film, optical member and display device comprising the same
TW202637672APending Publication Date: 2026-09-16DONGJIN SEMICHEM CO LTD
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Patent Information
- Application Number
- TW114148848
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-14
- Filing Date
- 2025-12-12
- Publication Date
- 2026-09-16
Abstract
The present invention provides a negative photosensitive resin composition comprising hollow silicon dioxide particles; an alkali-soluble silicone resin; and an epoxy-based first monomer or oligomer.
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