Photosensitive resin compositions, and dry films and optical waveguides using them

Abstract

One aspect of this invention relates to a photosensitive resin composition comprising: a cationic polymerizable compound (A) having a ladder-shaped silsesquioxane structure, an epoxy compound (B), a photocationic polymerization initiator (C), and an antioxidant; the photocationic polymerization initiator (C) comprises: a first photocationic polymerization initiator (C1) having a conjugate acid strength greater than or equal to that of HSbF6 and having a first anionic portion; and a second photocationic polymerization initiator (C2) having a conjugate acid strength lower than that of HSbF6 and having a second anionic portion; and the content of the epoxy compound (B) is 10 parts by mass or more and 90 parts by mass or less relative to 100 parts by mass of the cationic polymerizable compound (A); the content of the photocationic polymerization initiator (C) is 0.1 parts by mass or more and 5 parts by mass or less relative to the total of 100 parts by mass of the cationic polymerizable compound (A) and the epoxy compound (B); The content of the second photocationic polymerization initiator (c2) is 0.25 parts by mass or more and 2 parts by mass or less relative to 1 part by mass of the first photocationic polymerization initiator (c1); the content of the aforementioned antioxidant is 0.1 parts by mass or more and 3.0 parts by mass or less relative to 100 parts by mass of the total cationic polymerizable compound (A) and epoxy compound (B).

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