Resin compositions, adhesives, cured materials, electronic components and semiconductor devices

Abstract

This invention provides a resin composition capable of curing at low temperatures and in a short time, exhibiting excellent adhesion strength. A resin composition comprises: (A) a (meth)acrylate compound; (B) a polyfunctional thiol compound; and (C) a curing catalyst system containing at least one potential curing catalyst, wherein component (C) has the following characteristic (1). Characteristic (1): In the DSC plot of a mixed solution of 1.0 g of component (C) and 9.0 g of 1,3,4,6-tetrakis(3-mercaptopropyl)ethynylurea, the endothermic peak temperature is 50°C to 70°C, and the slope of the line segment connecting the start point and the peak of the endothermic peak is below -0.0007 mW / mg·°C.