Curable resins, methods for manufacturing curable resins, curable components, cured materials, prepregs, circuit boards, extension films, semiconductor sealants, and semiconductor devices.

Abstract

[Problem] This invention provides a curable resin that can form a hardened material with good dielectric properties after absorbing water, and whose tackiness is sufficiently reduced. [Solution] The curable resin of this invention comprises one or both of the structural units represented by formula (1) and formula (2), the structural unit represented by formula (3), and the structural unit represented by formula (4). (In the formulas, Q1 is independently a hydrogen atom or a methyl group, one of Q2 is a single bond, and the other three Q2 are independently hydrogen atoms or methyl groups, one of Q3 is a single bond, and the other three Q3 are independently hydrogen atoms or methyl groups, R1 is independently an alkyl, aryl, alkoxy, aryloxy, or halogen atom, m1 is an integer from 0 to 3, R2 is independently an alkyl, aryl, alkoxy, aryloxy, or halogen atom, m2 is an integer from 0 to 4, and * represents a bond.) none

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