Arylmethylene pyroxene resins, resin compositions, cured materials, prepregs, circuit boards, semiconductor sealants, and semiconductor devices.
TW202637684APending Publication Date: 2026-09-16DIC CORP
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Patent Information
- Application Number
- TW114139413
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-10-28
- Filing Date
- 2025-10-14
- Publication Date
- 2026-09-16
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Figure TWG2TA001076311_001 
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Abstract
[Problem] To provide an arylmethylidenefluorene resin that yields a cured product that combines processability and low dielectric loss tangent, as well as excellent heat resistance and low dielectric loss tangent after water absorption; a resin composition comprising the arylmethylidenefluorene resin; and a cured product of the resin composition. [Solution] An arylmethylidenefluorene resin represented by general formula (1). none
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