Methods for manufacturing components for protective film formation, protective films, substrates, and semiconductor devices.

Abstract

This invention provides a composition for forming a protective film, comprising a polymer having repeating units represented by formula (1) and repeating units represented by formula (2), and a solvent. (In formula (1), R1 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. X1 represents -O- or -NH-. R11 represents a single bond or a divalent group having 1 to 30 carbon atoms. n represents an integer from 2 to 5. In formula (2), R2 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. X2 represents -O- or -NH-. R21 represents a divalent group having 1 to 20 carbon atoms. However, the OH group bonded to R21 is bonded to a non-aromatic carbon atom of R21.)