Polyimide-based black polymer resin, photosensitive resin composition, cured product and display device comprising the same
TW202637702APending Publication Date: 2026-09-16DONGJIN SEMICHEM CO LTD
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Patent Information
- Application Number
- TW114148894
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-04-29
- Filing Date
- 2025-12-12
- Publication Date
- 2026-09-16
Abstract
The present invention provides a polyimide-based black polymer resin, which is polymerized from dianhydride monomers and diamine monomers, and provides a photosensitive resin composition, a cured body and a display device comprising the thereof.
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