Laminated substrates for optoelectronic fusion substrates, and optoelectronic fusion substrates

Abstract

One aspect of the present invention is a laminate for an optoelectronic fusion substrate, comprising, in sequence: a core layer with an average thickness of 1 μm to 10 μm, formed of a heat-resistant resin with a refractive index n1 that utilizes light with a wavelength of 1310 nm or 1550 nm; a lower cladding layer with an average thickness of 5 μm to 25 μm, formed of a heat-resistant resin with a refractive index n2 that utilizes light with a wavelength of 1310 nm or 1550 nm; and an insulating adhesive layer with an average thickness of 10 μm to 200 μm, formed of a thermosetting resin composition; wherein the volume resistivity of the cured insulating adhesive layer is 108 Ω·cm or more, and the refractive indices n1 and n2 satisfy the following relationship: 0.1 < 100 × (n1 - n2) / n1 < 5. none

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