Photosensitive resin composition, method for manufacturing patterned cured product, cured product, and electronic component

TW202637708APending Publication Date: 2026-09-16HD MICROSYSTEMS LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW115102535
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-01-22
Filing Date
2026-01-22
Publication Date
2026-09-16

Smart Images

  • Figure TWG2TA001077091_001
    Figure TWG2TA001077091_001
  • Figure TWG2TA001077091_002
    Figure TWG2TA001077091_002
Patent Text Reader

Abstract

A photosensitive resin comprising a resin, which is at least one of a cyclized resin and a precursor of the cyclized resin, a photosensitive agent, and a solvent, wherein the photosensitive agent comprises a photobleachable photosensitive agent, and the solvent comprises a solvent A and a solvent B having a vapor pressure at
Need to check novelty before this filing date? Find Prior Art