Resin composition, cured material, transfer film, multilayer, manufacturing method of cured material, manufacturing method of multilayer, manufacturing method of semiconductor device, and semiconductor device.

Abstract

A resin composition comprising a resin (A) which is at least one of a polyimide precursor and a polyimide, wherein the resin (A) has a structure represented by formula (1-1) as described in the specification, and the content of the structure represented by formula (1-1) as described in the specification in the resin (A) is 0.01% by mass or more and 5.0% by mass or less.