Method for manufacturing adhesive composition, laminate, and processed semiconductor substrate

Abstract

The present invention provides an adhesive composition for forming an adhesive layer, wherein the adhesive layer is used to temporarily bond a semiconductor substrate or electronic device layer to a support substrate; the adhesive composition contains an adhesive component that is cured by a hydrosiliconization reaction; the adhesive component contains a divalent or tetravalent platinum complex catalyst that does not contain halogen atoms.

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